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Manufacturing device and manufacturing method of micro-etching additive for etching and extracting copper

A technology for manufacturing devices and manufacturing methods, which is applied in the field of micro-etching additive manufacturing, which can solve the problems of difficult control of material addition, low product quality of micro-etching additives, and low production efficiency, so as to improve mass transfer and heat transfer, and industrial application High value and the effect of improving work efficiency

Pending Publication Date: 2022-02-15
昆山华拓环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the problems existing in the prior art, the present invention provides a manufacturing device and a manufacturing method of a micro-etching additive for etching and extracting copper. The manufacturing device solves the problems of low production efficiency, difficult control of material addition and The problem of low product quality of microetching additives

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  • Manufacturing device and manufacturing method of micro-etching additive for etching and extracting copper
  • Manufacturing device and manufacturing method of micro-etching additive for etching and extracting copper
  • Manufacturing device and manufacturing method of micro-etching additive for etching and extracting copper

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Embodiment 1

[0080] The present embodiment provides a manufacturing device for micro-etching additives for etching and extracting copper. The manufacturing device includes a processing container 2 and a storage container 6 arranged on the top of the base 1, and the top of the processing container 2 is provided with a cover member 203. The cover member 203 is connected to at least two raw material storage containers 402 through pipelines; the processing container 2 and the storage container 6 are connected through pipelines; the inside of the processing container 2 is provided with a heating component 201; the storage container 6 There is a filtering part inside.

[0081] The electric component 3 is arranged on the top of the cover component 203 . The electric component 3 is connected with a rotating rod 301 , and the rotating rod 301 extends through the cover member 203 to the inside of the processing container 2 . The outer wall of the rotating rod 301 is provided with four stirring memb...

Embodiment 2

[0092] The present embodiment provides a manufacturing device for micro-etching additives for etching and extracting copper. The manufacturing device includes a processing container 2 and a storage container 6 arranged on the top of the base 1, and the top of the processing container 2 is provided with a cover member 203. The cover member 203 is connected to at least two raw material storage containers 402 through pipelines; the processing container 2 and the storage container 6 are connected through pipelines; the inside of the processing container 2 is provided with a heating component 201; the storage container 6 There is a filtering part inside.

[0093] The electric component 3 is arranged on the top of the cover component 203 . The electric component 3 is connected with a rotating rod 301 , and the rotating rod 301 extends through the cover member 203 to the inside of the processing container 2 . The outer wall of the rotating rod 301 is provided with 8 stirring element...

Embodiment 3

[0102] The present embodiment provides a manufacturing device for micro-etching additives for etching and extracting copper. The manufacturing device includes a processing container 2 and a storage container 6 arranged on the top of the base 1, and the top of the processing container 2 is provided with a cover member 203. The cover member 203 is connected to at least two raw material storage containers 402 through pipelines; the processing container 2 and the storage container 6 are connected through pipelines; the inside of the processing container 2 is provided with a heating component 201; the storage container 6 There is a filtering part inside.

[0103] The electric component 3 is arranged on the top of the cover component 203 . The electric component 3 is connected with a rotating rod 301 , and the rotating rod 301 extends through the cover member 203 to the inside of the processing container 2 . The outer wall of the rotating rod 301 is provided with six stirring eleme...

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Abstract

The invention provides a manufacturing device and a manufacturing method of a micro-etching additive for etching and extracting copper, wherein the manufacturing device comprises a processing container and a storage container which are arranged at the upper part of a base, the top of the processing container is provided with a sealing cover part, and the sealing cover part is connected with at least two raw material storage containers through pipelines; the processing container is connected with the storage container through a pipeline; a heating part is arranged in the processing container; and a filtering part is arranged in the storage container. Through operation of the heating component, the interior of the processing container can be heated, the material processing efficiency is improved, the production rate of a micro-etching additive can be increased, and the working efficiency of workers is improved; and in addition, impurity particles can be removed by arranging the filtering part, and the product quality of the micro-etching additive is improved.

Description

technical field [0001] The invention relates to the technical field of manufacturing microetching additives, in particular to a manufacturing device and a manufacturing method of microetching additives for etching and extracting copper. Background technique [0002] Electroplating is the process of thickening the copper layer on the surface of the board and in the hole by electroplating, and electroplating a layer of anti-corrosion layer on the surface of the circuit pattern to protect the circuit. Form a microscopically rough surface to enhance the bonding force with the copper plating. The micro-etching in the electroplating process mainly depends on immersing the printed circuit board (PCB) in the potion, so that the potion and the PCB board produce a chemical reaction. [0003] For the micro-etching process, the manufacture of existing micro-etch additives is more critical, and there have been related researches on the manufacture of micro-etch additives, as follows: ...

Claims

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Application Information

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IPC IPC(8): B01F27/90B01F27/191B01F35/93B01F21/10B01F23/80B01F35/221
Inventor 邰康乾龙正
Owner 昆山华拓环保科技有限公司
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