Organic silicon die bonding adhesive for LED die bonding

Abstract

An organic silicon die bonding adhesive for LED die bonding comprises the following raw materials in parts by weight: 40 to 80 parts of MQ type methyl vinyl silicone resin, 10 to 20 parts of MDQ type methyl vinyl silicone resin, 10 to 20 parts of a cross-linking agent, 3 to 7 parts of special filler, 1 to 5 parts of a tackifier, 0.2 to 0.5 part of a catalyst and 0.4 to 1.0 part of an inhibitor. According to the prepared die bonding adhesive, the MQ type methyl vinyl silicone resin and the MDQ type methyl vinyl silicone resin are adopted as matrix resin, an M structural unit, a D structural unit and a Q structural unit in the molecular structure of the resin are optimally designed, so that the die bonding adhesive has an excellent three-dimensional network space structure; and meanwhile, a small amount of phenyl groups are introduced through the special filler, and the adhesive force after resin curing is enhanced; therefore, the prepared organic silicon die bonding adhesive not only has the inherent high-temperature yellowing resistance and high high-temperature thrust maintenance rate of methyl organic silicon die bonding adhesive, but also has the high adhesive strength performance of phenyl organic silicon die bonding adhesive.

Description

technical field [0001] The invention relates to an organic silicon crystal-bonding adhesive for LED crystal-bonding and a preparation process thereof, and belongs to the technical field of packaging application materials for semiconductor light-emitting chips. Background technique [0002] At present, in the intelligent and assembly line control production process of LED lights, the basic steps include die bonding, wire bonding, packaging, curing, and general testing. The most important step is wire bonding, which is to solder the pads on the LED chip and the conductive area on the LED bracket with metal wires. This is a very critical step, and it is carried out at high temperature. If the LED chip and the bracket are not bonded well at high temperature, it will lead to the failure of the welding wire. Most of the LED dead lights are caused by welding problems. In order to ensure the stable and high-quality wire bonding process, it is necessary to ensure that the LED chip a...

AI Technical Summary

Problems solved by technology

Phenyl silicone crystal-bonding glue contains a large amount of phenyl groups, which has high hardness and strong adhesion after curing, so it is widely used in low-power products packaged with small-sized chips. High-temperature yellowing resistance is poor, and the retention rate of die-bonding thrust at 150°C is about 45%; methyl silicone die-bonding adhesive, although it has excellent high-temperature yellowing resistance, and its solidity at 150°C The crystal thrust maintenance rate is about 70%, but the hardness after curing is lower than that of phenyl, resulting in poor adhesion. Therefore, it is generally used in medium and high-power products packaged with large-size chips.

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