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Underfill material and preparation method and application thereof

A technology of inorganic filler and epoxy resin, which is applied in the field of underfill materials and its preparation, and can solve problems such as poor reworkability, low Tg, and long curing time

Active Publication Date: 2022-02-18
XIAMEN WELDTONE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a high Tg and reworkable underfill that can be quickly filled and cured at room temperature in order to overcome the defects of long curing time, low Tg and poor reworkability of existing underfill materials Materials and their preparation methods and applications

Method used

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  • Underfill material and preparation method and application thereof
  • Underfill material and preparation method and application thereof

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preparation example Construction

[0032] The preparation method of the underfill material provided by the invention includes uniformly mixing each component to obtain the underfill material. The present invention has no special limitation on the way of mixing the components uniformly. In a preferred embodiment, the way of mixing uniformly is to add catalyst and optional silane coupling agent, stabilizer and inorganic filler to epoxy and uniformly dispersed in the resin to obtain an epoxy resin compound; adding a thiol compound to the epoxy resin compound and uniformly dispersed to obtain an underfill material. Wherein, the types and amounts of each component have been described above, and will not be repeated here.

[0033] The invention also provides the application of the underfill material in underfill for chips and PCB boards.

Embodiment 1

[0035] Embodiment 1 (equivalent ratio 0.01)

[0036] Step 1: Prepare 100g of 4-(diglycidylamino)phenyl glycidyl ether (having the structure shown in formula (1)), 4g of modified amine catalyst FXR-1020 and 1.2g of tetrakis(3-mercaptopropionic acid ) pentaerythritol esters;

[0037] Step 2: Add modified amine catalyst FXR-1020 to the 4-(diglycidylamino)phenyl glycidyl ether prepared in step 1, and disperse evenly through three-roll grinding to obtain an epoxy resin compound;

[0038] Step 3: Add pentaerythritol tetrakis(3-mercaptopropionate) into the epoxy resin compound obtained in Step 2, and disperse evenly at a speed of 2000 rpm to obtain the underfill material.

Embodiment 2

[0039] Embodiment 2 (equivalent ratio 0.12)

[0040] Step 1: Prepare 100g of 4-(diglycidylamino)phenyl glycidyl ether (with the structure shown in formula (1)), 4g of modified amine catalyst FXR-1020 and 15g of tetrakis(3-mercaptopropionic acid) Pentaerythritol esters;

[0041] Step 2: Add modified amine catalyst FXR-1020 to the 4-(diglycidylamino)phenyl glycidyl ether prepared in step 1, and disperse evenly through three-roll grinding to obtain an epoxy resin compound;

[0042] Step 3: Add pentaerythritol tetrakis(3-mercaptopropionate) into the epoxy resin compound obtained in Step 2, and disperse evenly at a speed of 2000 rpm to obtain the underfill material.

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Abstract

The invention belongs to the field of chip underfill materials, and relates to a high-Tg and repairable underfill material capable of rapidly filling at room temperature and a preparation method and application thereof. The underfill material contains epoxy resin, a thiol compound and a catalyst; the epoxy resin has a structure as shown in a formula (1); the equivalence ratio of the sulfydryl of the thiol compound to the epoxy group of the epoxy resin is 0.01-0.5. The thiol compound is used as a curing agent of the epoxy resin underfill material, the epoxy resin with a specific structure is selected, and meanwhile, the equivalence ratio of sulfydryl of the thiol compound to epoxy groups of the epoxy resin is controlled to be 0.01-0.5, so that the thiol compound can be used in an epoxy resin underfill material system, meanwhile, the purposes of high Tg, rapid filling at room temperature, rapid curing and reworking at high temperature are ensured.

Description

technical field [0001] The invention belongs to the field of chip underfill materials, in particular to an underfill material and its preparation method and application. Background technique [0002] The bottom mounting technology of the chip is the main way of interconnecting the chip and the terminal at present. In order to prevent the welding ball from breaking due to the large stress difference between the chip and the PCB board, it is often necessary to use an underfill material as the bottom between the chip and the PCB board. Padding treatment. [0003] Underfill materials are critical to the reliability of electronic materials such as mobile phones and computers. On the one hand, in order to obtain higher production capacity, the underfill material is required to flow quickly at room temperature and have the shortest possible curing time; on the other hand, in order to improve the reliability of the material, the underfill material is required to have a high Glass ...

Claims

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Application Information

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IPC IPC(8): C08G59/66C08G59/68C08L63/00C08K3/36
CPCC08G59/66C08G59/686C08K3/36C08L63/00
Inventor 林鸿腾刘涛李帅
Owner XIAMEN WELDTONE TECH CO LTD
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