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Cured object, overcoat film, and flexible wiring board

A technology of cured products and curable resins, applied in chemical instruments and methods, coating non-metallic protective layers, layered products, etc., can solve problems such as adverse effects of positioning accuracy, reduced yield of manufacturing processes, etc., and achieve excellent low warpage. curved effect

Pending Publication Date: 2022-02-22
NIPPON POLYTECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the flexible substrate is warped, it will adversely affect the positioning accuracy of the mounting position of the IC chip when the IC chip is mounted on the flexible wiring board in the packaging process, which may lead to a decrease in the yield in the manufacturing process

Method used

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  • Cured object, overcoat film, and flexible wiring board
  • Cured object, overcoat film, and flexible wiring board
  • Cured object, overcoat film, and flexible wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0245] Hereinafter, the present invention will be described in detail by way of examples and comparative examples.

[0246]

[0247] In the reaction vessel equipped with a stirring device, a thermometer and a condenser with a distillation device, add 983.5 g (6.74 mol) of phthalic anhydride and 879.2 g (7.44 mol) of 1,6-hexanediol, and use an oil bath to The inner temperature of the reaction vessel was raised to 140° C., and stirring was continued for 4 hours. Then, while continuing stirring, 1.74 g of mono-n-butyltin oxide was added.

[0248] Then, the internal temperature of the reaction vessel was slowly increased, and at the same time, the pressure in the reaction vessel was gradually reduced by a vacuum pump, and water was discharged out of the reaction vessel by distillation under reduced pressure. Finally, the internal temperature was raised to 220° C., and the pressure was reduced to 133.32 Pa. After 15 hours passed and it was confirmed that water was no longer dis...

manufacture example 1

[0307]In the container with stirrer, thermometer and condenser, add the epoxy compound represented by above-mentioned chemical formula (2) (made by Mitsubishi Chemical Co., Ltd., grade name JER604, epoxy equivalent 120g / eqv) 16.85 mass parts and diethyl ether 18.25 parts by mass of glycol diethyl ether was stirred, and after raising the internal temperature of the container to 40° C., stirring was continued for 30 minutes. After confirming that the epoxy compound was completely dissolved, it was cooled to room temperature to obtain an epoxy compound solution having a concentration of 48% by mass. This epoxy compound solution was used as curing agent solution E1.

manufacture example 2

[0309] In the container with agitator, thermometer and condenser, add cyclohexanedimethanol epoxy resin (made by Showa Denko Co., Ltd., grade name: Shofree (registered trademark) CDMDG, epoxy equivalent 126g / eqv) 21.66 parts by mass After stirring with 18.25 parts by mass of diethylene glycol diethyl ether, the inner temperature of the container was raised to 40° C., and then the stirring was continued for 30 minutes. After confirming that the epoxy compound was completely dissolved, it was cooled to room temperature to obtain an epoxy compound solution having a concentration of 48% by mass. This epoxy compound solution was used as curing agent solution E2.

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PUM

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Abstract

Provided is a cured object highly effective in preventing flexible wiring boards from warping and in inhibiting the flexible wiring boards from suffering wiring breakage. When examined by a pulse nuclear magnetic resonance method at a frequency of 20 MHz, the cured object formed from a curable resin composition gives a magnetization-intensity free induction decay signal f(t), which is for determining the spin-spin relaxation time T2 of a proton, and when the free induction decay signal f(t) is approximated by the following numerical expression, then the value of [A(1)*T2(1)+A(2)*T2(2)] calculated from the A(1), A(2), T2(1), and T2(2) contained in the numerical expression is 0.015 ms or less and the value of T2(3) is 0.50 ms or greater.

Description

technical field [0001] The present invention relates to a cured product, an overcoat film, and a flexible wiring board. Background technique [0002] The flexible wiring board is coated with an overcoat film for surface protection. The overcoat film is formed by coating and curing a curable resin composition on the surface of a flexible substrate on which wiring is formed by a printing method or the like. With the fine wiring processing of circuits formed on flexible wiring boards and the weight reduction and miniaturization of modules, curable resin compositions used to form overcoat films are required to have properties that make flexible substrates less likely to occur than before. warped performance. If the flexible substrate warps, it will adversely affect the positioning accuracy of the mounting position of the IC chip when the IC chip is mounted in the packaging process of the flexible wiring board, and may lead to a decrease in yield in the manufacturing process. ...

Claims

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Application Information

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IPC IPC(8): C08G18/08C08G18/42C08G18/44C08G59/40C08K3/013C08L63/00C08L75/04C08L101/12H05K3/28B32B15/092B32B15/095
CPCC08K3/013C08G18/44C08G59/40C08L75/04C08L101/12B32B15/095C08G18/08C08G18/42H05K3/28B32B15/092C08L63/00C08G18/4045C08G18/48C08G18/58C08K3/34C08K3/36C08L75/06
Inventor 石桥圭孝召田小雪山下未央木村和弥
Owner NIPPON POLYTECH CORP
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