Preparation method of copper-plated polymer film and product thereof
A polymer film and polymer technology, applied in flat products, other household appliances, pressure inorganic powder coating and other directions, can solve the problems of high cost of magnetron sputtering equipment, difficult process control, affecting product quality, etc. Improved time utilization, uniform coating, and increased yield
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preparation example Construction
[0057] figure 1 It is a schematic diagram of the device for the on-line copper plating film process using the preparation process of the present invention. It includes a die head 1 and a polymer melt 5 , the polymer melt 5 is extruded through the die head 1 , and a nozzle 2 , an air suction port 3 and a chill roll 4 are sequentially arranged in the forward direction of the polymer melt 5 .
[0058] The nozzles 2 are a group of two, symmetrically arranged above and below the polymer melt 5 . The vertical distance h between the nozzle 2 and the polymer melt 5 is 0.8 cm, and the horizontal distance d between the nozzle 2 and the die head 1 is 1.5 cm. The nozzle 2 is in the shape of a slit with a width of 0.01 mm and a length of 0.6 m. The nozzle 2 is connected with a silo storing nanometer copper powder.
[0059] The air suction port 3 is also a group of two, symmetrically arranged above and below the polymer melt 5 . The vertical height of the suction port 3 from the polymer...
Embodiment 1
[0061] First, the solid polyphenylene sulfide powder (manufactured by Zhejiang NHU Special Materials Co., Ltd., brand name NHU-PPS3508P, weight average molecular weight 60000-65000) is melted, extruded and pelletized into granules by twin-screw extruder solid, then put it into vacuum drying, and take away the excess water by controlled dry nitrogen gas, which is used as the final raw material for film production.
[0062] The dried pellets are fed into a twin-screw extruder for melting, metered, and sent to a die, and the temperature of the melt extruded through the die is controlled to be 285°C. While the die is extruding, the nozzle extrudes copper powder to the surface of the melt, wherein the D50 of the copper powder is 40nm, the compressed air pressure is 0.5MPa, the air pressure at the suction port is 8000Pa, and the speed of the chilling roll is 50m / min. sheet of copper layer.
[0063] Then the sheet is sent to the longitudinal stretching machine for 3.4 times of stret...
Embodiment 2
[0067] In this embodiment, the D50 of the copper powder is 50 nm, the compressed air pressure is 0.5 MPa, the air pressure at the suction port is 8000 Pa, and the chill roll speed is 50 m / min.
[0068] Except for this, the same steps as in Example 1 were used to prepare a PPS film.
[0069] For the PPS film obtained by the above method, the evaluation results are shown in Table 1. The film warpage performance is excellent, and the copper layer as a buffer layer has a thickness of nanometers and excellent uniformity.
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