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Microbridge structure and preparation method thereof

A technology of micro-bridge structure and micro-nano structure, which is applied in the field of optical devices, can solve the problems of reduced filling factor and performance of bolometers, etc., and achieve the effects of improving absorption rate and reducing reflection and transmission.

Pending Publication Date: 2022-03-01
SHENZHEN METALENX TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to solve the technical problem in the related art that the fill factor decreases as the pixel size decreases, resulting in a decrease in the performance of the bolometer, an embodiment of the present application provides a microbridge structure and a bolometer including it and a manufacturing method

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  • Microbridge structure and preparation method thereof
  • Microbridge structure and preparation method thereof
  • Microbridge structure and preparation method thereof

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Embodiment Construction

[0077] In order to make the purpose, technical solution and advantages of the present application clearer, the implementation manners of the present application will be further described in detail below in conjunction with the accompanying drawings. It should be noted that, unless otherwise clearly stipulated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be A mechanical connection can also be an electrical connection: it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the embodiments of the present application in specific situations.

[0078] It should be understood that in the description of the present application, terms such as "fir...

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Abstract

The invention provides a micro-bridge structure and a preparation method thereof, and belongs to the technical field of optics. The micro-bridge structure comprises an absorption layer, a thermosensitive layer and an electric connection layer, wherein the absorption layer, the thermosensitive layer and the electric connection layer are sequentially arranged along the incident direction of incident radiation; a micro-nano structure is arranged on one side, facing incident radiation, of the absorption layer, and the micro-nano structure is a sub-wavelength structure. According to the micro-bridge structure and the preparation method thereof provided by the embodiment of the invention, the absorption rate of the micro-bridge structure to incident radiation is increased under the condition that the filling coefficient of the absorption layer is not increased, and the performance of the micro-bridge structure is improved, so that the performance of the bolometer adopting the micro-bridge structure is improved.

Description

technical field [0001] The present application relates to the technical field of optical devices, in particular to a microbridge structure and a preparation method thereof. Background technique [0002] A bolometer includes an absorbing layer, a thermosensitive layer and an electrical connection layer. The infrared radiation absorbed by the absorbing layer is converted into an electrical signal by the heat-sensitive layer, and then output through the electrical connection layer, thereby realizing infrared detection. Microbridge structures including absorbing layers are often employed to enhance the performance of bolometers. The absorbing layer is located on the bridge deck of the micro-bridge structure, and the bridge deck is supported by the bridge legs. The larger the duty cycle of the bridge legs, the more stable the micro-bridge structure; the thinner the bridge legs, the better the thermal insulation of the micro-bridge structure. The parameter fill factor to measur...

Claims

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Application Information

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IPC IPC(8): G01J5/24B81B7/00B81C1/00
CPCG01J5/24B81B7/0058B81C1/00142B81B2201/0278
Inventor 郝成龙谭凤泽朱健
Owner SHENZHEN METALENX TECH CO LTD