Supercharge Your Innovation With Domain-Expert AI Agents!

BiCuSnNiP series high-temperature lead-free solder and preparation method thereof

A lead-free solder, high temperature technology, used in welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems of high brittleness and low wettability, and achieve high welding bonding force, fine grain size, and reduced The effect of solder cost

Active Publication Date: 2022-03-18
山东康普锡威新材料科技有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, BiAg-based solders generally suffer from high brittleness and low wettability

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • BiCuSnNiP series high-temperature lead-free solder and preparation method thereof
  • BiCuSnNiP series high-temperature lead-free solder and preparation method thereof
  • BiCuSnNiP series high-temperature lead-free solder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] A BiCuSnNiP high-temperature lead-free solder alloy used in the field of high-temperature soldering, the lead-free solder alloy contains: Cu 12%, Sn 18.2%, Ni: 1000ppm, P: 500ppm, and the rest are Bi and unavoidable impurities, the lead-free solder alloy has a melting point of 290.5-328.2°C. The method for preparing the lead-free solder alloy comprises the following steps:

[0050] 1) Metals Bi and Cu, Bi and Ni, Bi and P with a purity of 99.99wt.% were added to the vacuum melting furnace according to the weight ratio, and the vacuum treatment was carried out to 1×10 -1 Pa, after filling with nitrogen; heating to 650-700°C for melting, while adding electromagnetic stirring to make the alloy composition uniform, and then vacuum casting to prepare Bi-Cu10, Bi-Ni5, Bi-P2 master alloys;

[0051] 2) Add the prepared Bi-Cu, Bi-Ni and Bi-P master alloys and metal Sn into the melting furnace according to the alloy ratio. Cover the surface of the alloy with an anti-oxidation s...

Embodiment 2

[0053] A BiCuSnNiP high-temperature lead-free solder alloy used in the field of high-temperature soldering, the lead-free solder alloy contains: Cu 6%, Sn 12.4%, Ni: 100ppm, P: 50ppm, and the rest are Bi and unavoidable impurities, the melting point of the lead-free solder alloy is 288.3-307.5°C. The method for preparing the lead-free solder alloy is the same as that in Example 1 except that the alloy ratio is different.

[0054] The photo of the metallographic structure of the solder alloy prepared in this embodiment is as follows figure 1 As shown, the microstructure distribution of the alloy can be seen from the figure.

Embodiment 3

[0056] A BiCuSnNiP high-temperature lead-free solder alloy used in the field of high-temperature soldering, the lead-free solder alloy contains: Cu 10%, Sn 16.8%, Ni: 600ppm, P: 800ppm, and the rest are Bi and unavoidable impurities, the melting point of the lead-free solder alloy is 289.1-320°C. The method for preparing the lead-free solder alloy is the same as that in Example 1 except that the alloy ratio is different.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Melting pointaaaaaaaaaa
Melting pointaaaaaaaaaa
Melting pointaaaaaaaaaa
Login to View More

Abstract

The invention relates to a BiCuSnNiP series high-temperature lead-free solder which comprises the following components in percentage by mass: 5.0%-15.0% of Cu, 10.0%-20.0% of Sn, gt of Ni and the balance of Sn. 0 and < = 1500 ppm, P: gt; 0 < = 1000 ppm, with the balance being Bi and unavoidable impurities. The wettability of the high-temperature lead-free solder is remarkably improved compared with that of Bi2.6Ag series solder, and the high-temperature lead-free solder is high in strength. The invention further relates to a preparation method of the BiCuSnNiP series high-temperature lead-free solder.

Description

technical field [0001] The invention relates to the technical field of high-temperature solder, in particular to a BiCuSnNiP-based high-temperature lead-free solder and a preparation method thereof. Background technique [0002] Most known chip connection methods use high-temperature solder to connect the semiconductor chip in the integrated circuit to the lead frame to form a mechanical connection, and to enable heat conduction and electrical conduction between the chip and the lead frame. With the development of miniaturization and multi-function of electronic equipment, advanced electronic packaging technology has also developed, such as flip-chip (FC) packaging technology, multi-chip module (MCM) packaging technology, etc. In high-end flip-chip packaging, high-temperature solder is also required; in multi-chip module packaging, multi-step soldering is often required, and the primary package needs to use high-temperature solder first to ensure that the second step uses lo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40B23K35/0255
Inventor 刘希学贺宝安宁王志刚朱学新赵法家王涛刘建王刚
Owner 山东康普锡威新材料科技有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com