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High-density PCB design method based on microstrip line far-end crosstalk

A technology of far-end crosstalk and design method, applied in the direction of computer design circuit, electrical components, printed circuit manufacturing, etc., can solve problems such as increasing PCB size, save space, improve PCB design success rate, and solve signal integrity problems. Effect

Pending Publication Date: 2022-03-22
DALIAN UNIV OF TECH
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AI Technical Summary

Problems solved by technology

At present, the far-end crosstalk suppression of microstrip lines generally includes two methods: one is to reduce crosstalk by adding circuit components to signal processing, and additional circuit components will increase the PCB area; the other is to change the circuit board or The physical parameters of the transmission line suppress electromagnetic coupling, thereby reducing crosstalk, which generally increases PCB size

Method used

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  • High-density PCB design method based on microstrip line far-end crosstalk
  • High-density PCB design method based on microstrip line far-end crosstalk
  • High-density PCB design method based on microstrip line far-end crosstalk

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Embodiment Construction

[0022] The present invention will be further described below in conjunction with accompanying drawing.

[0023] Such as figure 1 As shown, a high-density PCB board design method based on microstrip far-end crosstalk includes the following steps:

[0024] Step 1. Set the characteristic impedance of the PCB microstrip line and the line width of the microstrip line. First, select the PCB material made of copper clad material (FR4 material), then set the thickness of the microstrip line, and calculate the distance between the microstrip line and the ground layer , when the microstrip line is selected as the transmission model, the characteristic impedance Z of the microstrip line 0 Described by formula (1),

[0025]

[0026] In the formula, ε r Represents the relative permittivity of the PCB board, h represents the distance between the microstrip line and the ground, w represents the width of the microstrip line, and t represents the thickness of the microstrip line. Here, t...

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Abstract

The invention belongs to the technical field of electrical equipment and electrical engineering, and relates to a microstrip line far-end crosstalk-based high-density PCB (printed circuit board) design method, which comprises the following steps of (1) setting PCB microstrip line characteristic impedance and microstrip line width, (2) performing high-density layout on microstrip lines, (3) performing simulation analysis on crosstalk generated by six attack lines around an affected line, and (4) performing simulation analysis on the crosstalk generated by six attack lines around the affected line. And (4) the far-end crosstalk coefficient is less than 5% by adjusting the PCB parameters and the microstrip line spacing. Compared with the prior art, the high-density PCB design method based on the microstrip line far-end crosstalk has the advantages that the high-density PCB layout rule can be obtained according to the microstrip line far-end crosstalk, the signal integrity problem is solved at the initial stage of PCB design, the success rate of PCB design is improved, meanwhile, the PCB is high in density, and space is saved.

Description

technical field [0001] The invention relates to a high-density PCB board design method based on microstrip line far-end crosstalk, and belongs to the technical field of electrical equipment and electrical engineering. Background technique [0002] With the development trend of high frequency and integration, the crosstalk problem of printed circuit boards (Printed circuit boards, PCB) transmission lines is becoming more and more serious. Crosstalk is one of the four types of signal integrity problems. There are both electric field coupling and magnetic field coupling between transmission lines, and crosstalk will occur under the combined action of the two. At present, the far-end crosstalk suppression of microstrip lines generally includes two methods: one is to reduce crosstalk by adding circuit components to signal processing, and additional circuit components will increase the PCB area; the other is to change the circuit board or The physical parameters of the transmissi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/00H05K3/0005
Inventor 董维杰任冰心解永平
Owner DALIAN UNIV OF TECH
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