Manufacturing method of micro spherical crown array

Abstract

The invention discloses a manufacturing method of a micro spherical crown array, and belongs to the technical field of micro machining. The method comprises the following steps: forming a uniform liquid surface layer on the surface of a substrate by using a curable material; controlling the substrate to be at a set temperature and keeping the set temperature until the temperature and the flowing state of the curable material reach a stable state; the set temperature is a certain fixed temperature between 10 DEG C to 35 DEG C and 45 DEG C to 120 DEG C; enabling one side of the groove of the PDMS sheet with the circular groove array to be in contact with the liquid surface layer, and keeping the contact until the contact between the liquid surface layer and the PDMS sheet reaches a stable state; and carrying out curing treatment on the liquid surface layer, and stripping the PDMS sheet to obtain the micro spherical crown array. The geometric structure and the size of the micro spherical crown are controlled by controlling the set temperature; due to the fact that the cured SU-8 or epoxy resin has high optical transmittance, the micro spherical crown array manufactured through the method can be used as a micro lens array or a mold for manufacturing other materials such as PDMS micro lens arrays.

Description

technical field [0001] The invention belongs to the technical field of micromachining, and in particular relates to a method for manufacturing a microsphere crown array. Background technique [0002] Machining curved surfaces is a difficult point in micromachining. Taking the surface microstructure of silicon wafers as an example, the commonly used methods are wet etching and dry etching. Wet etching removes silicon material along a certain crystal direction by using an etching solution. This method is greatly affected by the silicon crystal orientation, and the etching process is not easy to control. Dry etching uses plasma for etching, which has reached nanometer-level processing accuracy and can better control the processing process. However, dry etching has low processing efficiency and high cost, and can only be processed in one direction. Difficult to achieve surface processing. In the prior art, there is a technical solution for forming a microlens concave mold usin...

AI Technical Summary

Problems solved by technology

Wet etching removes silicon material along a certain crystal direction by using an etching solution. This method is greatly affected by the silicon crystal orientation, and the etching process is not easy to control.

Dry etching uses plasma for etching, which has reached nanometer-level processing accuracy and can better control the processing process. However, dry etching has low processing efficiency and high cost, and can only be processed in one direction. Difficult to achieve curved surface processing

In the prior art, there is a technical solution for forming a microlens concave mold using the Cassie wetting principle, but there is no technical solution for how to control the geometry and size of the microstructure

Images