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Novel low-expansion high-thermal-conductivity micro-channel bottom plate

A micro-channel, low-expansion technology, used in semiconductor devices, cooling/ventilation/heating transformation, semiconductor/solid-state device components, etc., can solve the problems of reducing system thickness and size, high thermal conductivity, low thermal expansion coefficient, etc. The effect of improving the heat dissipation capacity, reducing the thickness and weight

Pending Publication Date: 2022-03-29
CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST
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Problems solved by technology

The bottom plate selects different materials according to the functional requirements and process requirements of different positions in the space, so as to solve the problems of light weight, high strength, high thermal conductivity, low thermal expansion coefficient, and easy processing that cannot be satisfied by the above-mentioned single material at the same time, so as to adapt to the low profile of the radar High power density design improves system heat dissipation performance while significantly reducing system thickness

Method used

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  • Novel low-expansion high-thermal-conductivity micro-channel bottom plate

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specific Embodiment

[0038] like figure 1 As shown, a novel low expansion and high thermal conductivity microchannel bottom plate of the present invention includes a microchannel composite cavity 1 and a composite cover plate 2 .

[0039] The micro-channel composite cavity 1 has an external shape of a special-shaped composite metal plate, which is formed by spatial compounding of Al / SiC (65%) and aluminum alloy 3A21, and the external dimension is 142 × 104 × 3 (mm). The main body of the micro-channel composite base plate is a SiC / Al matrix 1-1: one side is flat, which is used for welding power devices with low expansion coefficient; the other panel is distributed with open serpentine water channels, and aluminum alloy cooling columns are arranged inside the water channels 1-2 to enhance cooling capacity. The diameter of the aluminum alloy heat dissipation column is φ1mm and the height is 2mm. The spatial arrangement comprehensively considers the position of the heating device, the flow resistance...

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Abstract

The invention relates to a novel low-expansion high-thermal-conductivity micro-channel bottom plate which comprises a micro-channel composite cavity and a composite cover plate, the micro-channel composite cavity is a special-shaped composite metal plate with a snakelike open water channel in appearance, and the composite cover plate is a special-shaped composite metal plate with a boss in appearance and is formed by compositing Al / SiC and aluminum alloy. Different materials are selected for the low-expansion and high-thermal-conductivity micro-channel bottom plate according to functional requirements and process requirements of different positions in space, so that the problems that the single material cannot meet the requirements of light weight, high strength, high thermal conductivity, low thermal expansion coefficient and easy processability at the same time are solved, and the low-profile and high-power-density design of a radar is adapted; and the heat dissipation performance of the system is improved while the thickness size of the system is remarkably reduced.

Description

technical field [0001] The invention relates to a channel bottom plate, in particular to a novel low-expansion and high thermal conductivity micro-channel bottom plate. Background technique [0002] As the "eye of the three armies, the most important weapon of the country", the radar plays an important role in modern warfare, and the radar of the active phased array system is more and more loaded on various types of radar due to its superiority in structure and performance. Different functions are implemented on the platform. In order to adapt to various platforms, active phased array radars are also gradually developing in the direction of thinness, building blocks and high power density. [0003] The TR component is the core device of the phased array radar and the main heating device. Due to the low thermal expansion coefficient of the chip inside the TR module, in order to adapt to it, we generally use a metal shell with a low expansion coefficient to encapsulate it se...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473H01L23/14H05K7/20
CPCH01L23/473H01L23/14H05K7/20218
Inventor 张彦赵希芳肖瑞钟剑锋吕晓卫
Owner CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST
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