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Thermoelectric separation copper substrate manufacturing method

A manufacturing method, thermoelectric separation technology, applied in the direction of printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problems of improvement, the complexity of the circuit board structure, the influence of the stability of the circuit board structure, etc., to achieve mature process methods, structure simple effect

Pending Publication Date: 2022-04-01
珠海和进兆丰电子科技有限公司
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Problems solved by technology

[0002] At present, in order to improve the heat dissipation effect of the circuit board, the thermal resistance of the heat transfer path is generally reduced by embedding metal or ceramics in the circuit board. However, embedding metal or ceramics on the circuit board will greatly increase the complexity of the circuit board structure. It has a certain impact on the stability of the circuit board structure, and with the increase in the complexity of the structure, the manufacturing process of the circuit board will also become more variable and complicated, which is not conducive to the improvement of production efficiency and yield rate

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  • Thermoelectric separation copper substrate manufacturing method
  • Thermoelectric separation copper substrate manufacturing method
  • Thermoelectric separation copper substrate manufacturing method

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Embodiment Construction

[0020] The features of the present invention and other relevant features are described in further detail below through the embodiments, so as to facilitate the understanding of those skilled in the art:

[0021] Such as Figure 1 to Figure 3 Shown, a kind of thermoelectric separation copper substrate manufacturing method, comprises the following steps:

[0022] Step 1: Provide a copper substrate 1 and a piece of RCC material 2, the RCC material 2 includes a copper foil layer 21 and an insulating adhesive layer 22 distributed up and down;

[0023] Step 2: Etching a number of heat conducting bosses 11 on the copper substrate 1;

[0024] Step 3: Cutting out an escape channel 23 corresponding to the position and shape of the heat conduction boss 11 on the block of RCC material 2 by laser cutting or stamping;

[0025] Step 4: fit the RCC material 2 on the copper substrate 1 through the escape channel 23 and the heat conduction boss 11, so that the insulating adhesive layer 22 is ...

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Abstract

The invention discloses a method for manufacturing a thermoelectric separation copper substrate, which comprises the following steps of: 1, providing a copper substrate and an RCC material which comprises a copper foil layer and an insulating glue layer which are distributed up and down; 2, etching a plurality of heat conduction bosses on the copper substrate; thirdly, clearance channels corresponding to the heat conduction bosses in position and shape are formed in the RCC material block through laser cutting or stamping; 4, sleeving the RCC material on the copper substrate through the cooperation of the clearance channel and the heat conduction boss, and enabling the insulating glue layer to be in contact with the copper substrate; 5, pressing and bonding the copper substrate and the RCC material into a whole by using the insulating glue layer through heating and pressing; and 6, etching a circuit pattern on the surface of the foil layer of the RCC material.

Description

technical field [0001] The invention relates to a method for manufacturing a thermoelectric separation copper substrate. Background technique [0002] At present, in order to improve the heat dissipation effect of the circuit board, the thermal resistance of the heat transfer path is generally reduced by embedding metal or ceramics in the circuit board. However, embedding metal or ceramics on the circuit board will greatly increase the complexity of the circuit board structure. It has a certain impact on the stability of the circuit board structure, and as the complexity of the structure increases, the manufacturing process of the circuit board will also become more varied and complicated, which is not conducive to the improvement of production efficiency and yield rate. [0003] Therefore, how to overcome the above existing defects has become an important issue to be solved urgently by those skilled in the art. Contents of the invention [0004] The invention overcomes t...

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Application Information

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IPC IPC(8): H05K3/00H05K1/02
Inventor 张金友
Owner 珠海和进兆丰电子科技有限公司
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