Photoelectrochemical flexible wearable sweat pH sensor based on bismuth oxide p-n type conversion potential
A photoelectrochemical and pH sensor technology, applied in the direction of material electrochemical variables, scientific instruments, instruments, etc., can solve problems such as inaccurate measurement, achieve the effect of solving inaccurate measurement, low preparation cost, and high application value
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Embodiment 1
[0046] A Bi-based 2 o 3 Photoelectrochemical flexible wearable sweat pH sensor with p-n type transition potential, including Bi 2 o 3 Working electrode, reference electrode, counter electrode, transparent flexible substrate and light source. The width of the working electrode, reference electrode and counter electrode is 5mm, and the electrode spacing is 1.5mm (such as figure 1 shown), the light source is 0.2W, and the wavelength is 440nm.
[0047] Bi 2 o 3 Preparation steps of the working electrode:
[0048] (1) Deposit an indium-doped tin oxide (ITO) film on a transparent and flexible mica substrate by radio frequency magnetron sputtering, using an indium-doped tin oxide (ITO) target with a purity of 99.99%, and a sputtering power of 100W , the substrate temperature is 200° C., the argon flow rate is 30 sccm, the sputtering pressure is 1.5 pa, the deposition time is 2400 s, and the substrate rotation speed is 20 r / min.
[0049] (2) Deposit Bi metal on the ITO thin f...
Embodiment 2
[0064] With reference to Example 1, the difference is that Bi 2 o 3 Preparation of working electrode, reference electrode and counter electrode.
[0065] Bi 2 o 3 Preparation steps of the working electrode:
[0066] (1) Deposit an indium-doped tin oxide (ITO) film on a transparent and flexible mica substrate by radio frequency magnetron sputtering, using an indium-doped tin oxide (ITO) target with a purity of 99.99%, and a sputtering power of 150W , the substrate temperature is 350° C., the argon flow rate is 30 sccm, the sputtering pressure is 2 pa, the deposition time is 1200 s, and the substrate rotation speed is 30 r / min.
[0067] (2) Deposit Bi metal on the ITO thin film obtained in step (1) by DC magnetron sputtering, using a Bi metal target with a purity of 99.99%, the sputtering power is 60W, the substrate temperature is 350°C, and the argon flow rate is 50sccm, the sputtering pressure is 2pa, the deposition time is 100s, and the substrate rotation speed is 30r / mi...
Embodiment 3
[0076] Referring to Example 1, the difference lies in the preparation of the counter electrode.
[0077] Preparation steps of the counter electrode:
[0078] Graphite was deposited on flexible polyester (PET) by DC magnetron sputtering, using a graphite target with a purity of 99.99%, the sputtering power was 100W, the substrate temperature was 200°C, the argon flow rate was 30sccm, and the sputtering pressure was 1.0 pa, the deposition time is 60 min, and the substrate rotation speed is 30 r / min to obtain the counter electrode.
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