Coating for circuit board base plate and preparation method thereof
A circuit board and coating technology, which is applied in the field of coating for circuit board backing and its preparation, can solve the problems of low surface hardness, unattainable hardness of phenolic cardboard, influence of drilling quality, etc., achieve high surface hardness, improve Cross-linking density, the effect of improving the lubricating effect
Inactive Publication Date: 2022-04-12
深圳市图特美高分子材料有限公司
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Problems solved by technology
[0003] The circuit board backing plate needs to have good hardness to prevent and reduce the burrs on the surface of the drilled hole; the traditional medium density and high density fiberboard cannot meet the quality requirements of the drilled hole, and the surface hardness is relatively low; while the traditional resin coating can Partially improve the hardness of the wire board, but it cannot reach the hardness of the phenolic cardboard, which still has a certain impact on the drilling quality
Method used
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preparation example Construction
[0042] Preparation example of ethylenediamine solution
[0043] The following raw materials are all commercially available.
preparation example 1
[0044] Preparation example 1: Ethylenediamine solution is prepared by the following method:
[0045] Weigh ethylenediamine, put it in water, stir and dissolve it, and prepare a solution with a mass fraction of 10%; weigh the solution with a weight ratio of 10:1, and mix and stir the solution with a mass fraction of 1% sodium alginate, and stir evenly to obtain Ethylenediamine solution.
preparation example 2
[0046] Preparation example 2: Ethylenediamine solution is prepared by the following method:
[0047] Weigh ethylenediamine and place it in water, stir and dissolve to obtain a solution with a mass fraction of 5%; weigh the solution and a sodium alginate solution with a mass fraction of 1% at a weight ratio of 8:1, mix and stir, and stir evenly to obtain Ethylenediamine solution.
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Abstract
The invention relates to the field of high polymer materials, and particularly discloses a coating for a circuit board base plate and a preparation method of the coating. The invention discloses a coating for a circuit board base plate. The coating is prepared by curing a coating, the coating is prepared from the following raw materials in parts by weight: 30-50 parts of epoxy resin, 6-10 parts of a curing agent, 3-5 parts of a cross-linking agent, 1-3 parts of an additive, 40-60 parts of filler and 3-5 parts of toner, the preparation method comprises the following steps: weighing the epoxy resin and the filler, and uniformly stirring and mixing to obtain a mixture; weighing a curing agent, a cross-linking agent, a toner and an additive, uniformly mixing and stirring with the mixture, and performing vacuum defoaming to obtain a coating; drying and curing the paint to form a coating; and the coating has relatively high surface hardness.
Description
technical field [0001] The application relates to the field of polymer materials, more specifically, it relates to a coating for a circuit board backing plate and a preparation method thereof. Background technique [0002] The circuit board backing plate is made of high-density fiberboard as the substrate, and the surface is coated with a coating. [0003] The circuit board backing plate needs to have good hardness to prevent and reduce the burrs on the surface of the drilled hole; the traditional medium density and high density fiberboard cannot meet the quality requirements of the drilled hole, and the surface hardness is relatively low; while the traditional resin coating can Partially improve the hardness of the wire board, but it cannot reach the hardness of the phenolic cardboard, which still has a certain impact on the drilling quality. [0004] Therefore, there is an urgent need to prepare a coating with higher hardness to reduce the roughness and burrs on the edge ...
Claims
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IPC IPC(8): C09D163/02C09D163/04C09D7/61C09D7/62
Inventor 王昌平王姗胡振明
Owner 深圳市图特美高分子材料有限公司