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Metal backboard and manufacturing method thereof, backlight module and electronic equipment

A metal backplane and backlight module technology, which is applied in manufacturing tools, sub-office equipment, heat treatment equipment, etc., can solve problems such as defects and metal backplanes that are prone to warped appearance

Pending Publication Date: 2022-04-12
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the metal backplane of the O-state aluminum-magnesium alloy material is prone to warping and other poor appearance problems.

Method used

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  • Metal backboard and manufacturing method thereof, backlight module and electronic equipment
  • Metal backboard and manufacturing method thereof, backlight module and electronic equipment
  • Metal backboard and manufacturing method thereof, backlight module and electronic equipment

Examples

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Embodiment Construction

[0035] Exemplary embodiments will be described in detail herein, and examples are illustrated in the drawings. The following description is related to the drawings, unless otherwise indicated, the same figures in the different drawings represent the same or similar elements. The embodiments described in the exemplary embodiments described below do not represent all embodiments consistent with the present disclosure. Instead, they are only examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0036] The terms used in the present disclosure are only for the purpose of describing particular embodiments, not intended to limit the disclosure. Unless otherwise defined, the technical terms or scientific terms used in this disclosure should be understood by those who have general skills in the art of this disclosure. The "first" "second" and similar words used in the present disclosure and the claims do not represent...

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Abstract

The invention provides a metal backboard and a manufacturing method thereof, a backlight module and electronic equipment. The metal backboard is used for the backlight module and comprises a first area and a second area, the grain size of a metal material in the first area is larger than that of a metal material in the second area, and a first opening is formed in the first area. The ductility of the first area of the metal back plate is larger than that of the second area, so that the first opening is not prone to cracks, the mechanical strength and hardness of the second area are larger than those of the first area, and the metal back plate does not have the poor appearance problems such as deformation, upwarp and scratches in the manufacturing and assembling process.

Description

Technical field [0001] The present disclosure relates to the technical field of electronic equipment, and more particularly to a metal backing plate and a manufacturing method thereof, a backlight module and an electronic device. Background technique [0002] With the rapid development of electronic equipment, high-capacity battery and high integration electronic equipment are favored by people. By increasing the weight of the battery, the battery has a large capacity, but this makes the weight of the electronic device, which is not conducive to the promotion of the comfort of the user. In order to reduce the weight of the electronic device, the material of the metal back panel of the backlight module can be adjusted, for example, a small density aluminum magnesium alloy material replaces the original stainless steel material of the metal backplane. However, the metal backplane of the O-state aluminum-magnesium alloy material is prone to appearance and other appearances. Inventi...

Claims

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Application Information

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IPC IPC(8): G02F1/1333B23P15/00
CPCC21D2261/00C21D2221/00C21D9/46C21D8/0247C21D1/26C21D1/28C21D8/0226C21D1/46C21D1/48C22C21/06C22F1/047C21D8/0294G06F1/1626G06F1/1656G06F1/1686B21D51/52B21D22/02B21D28/02H04M1/22H04M1/0264G02B6/0011G02B6/0055B23P15/00C21D8/02G02B6/0081
Inventor 王征
Owner BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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