Curved fly's-eye lens based on DMD digital photoetching and preparation method of curved fly's-eye lens
A curved surface compound eye and lens technology, which is applied in the field of curved surface compound eye lens and its preparation, can solve the problems of small field of view, cumbersome process, and high cost, and achieve the effects of controllable arc bending, reduced manufacturing difficulty, and improved production efficiency
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Embodiment 1
[0048] This embodiment provides a method for preparing a curved fly-eye lens based on DMD digital lithography, comprising the following steps:
[0049] (1) Select a silicon wafer as the substrate, prepare a mixed solution of hydrofluoric acid and hydrogen peroxide at a volume ratio of 10:1, place the silicon wafer in the mixed solution for 2 min, and then rinse the surface of the silicon wafer with flowing deionized water. Then place the silicon wafer in an oven and bake for 5 minutes, so as to completely evaporate excess water and ensure that the surface of the silicon wafer is dry.
[0050] (2) AZ9260 positive photoresist was applied at a speed of 400rpm for 30s, and the thickness of the photoresist layer finally coated on the silicon wafer was about 20 μm. Subsequent pre-baking of the photoresist is carried out, and the process parameters of 120°C / 3min are adopted, that is, the silicon wafer after the uniform glue is placed on a baking plate with a constant temperature of 1...
Embodiment 2
[0068] This embodiment provides a method for preparing a curved fly-eye lens based on DMD digital lithography, comprising the following steps:
[0069] (1) Select a silicon wafer as the substrate, prepare a mixed solution of hydrofluoric acid and hydrogen peroxide at a volume ratio of 10:1.5, soak the silicon wafer in the mixed solution for 1 min, and then rinse the surface of the silicon wafer with flowing deionized water, Then place the silicon wafer in an oven and bake for 8 minutes, so as to completely evaporate excess water and ensure that the surface of the silicon wafer is dry.
[0070] (2) AZ9260 positive photoresist was applied at a speed of 350 rpm for 30 s, and the thickness of the photoresist layer finally coated on the silicon wafer was about 20 μm. Subsequently, the photoresist is pre-baked, and the process parameter of 120°C / 3min is adopted, that is, the silicon wafer after the uniform glue is placed on a baking plate with a constant temperature of 110°C and bak...
Embodiment 3
[0077] This embodiment provides a method for preparing a curved fly-eye lens based on DMD digital lithography, comprising the following steps:
[0078](1) Select a silicon wafer as the substrate, prepare a mixed solution of hydrofluoric acid and hydrogen peroxide at a volume ratio of 10:1, place the silicon wafer in the mixed solution for 2 min, and then rinse the surface of the silicon wafer with flowing deionized water. Then place the silicon wafer in an oven and bake for 10 minutes, so as to completely evaporate excess water and ensure that the surface of the silicon wafer is dry.
[0079] (2) AZ9260 positive photoresist was applied at a speed of 400rpm for 30s, and the thickness of the photoresist layer finally coated on the silicon wafer was about 20 μm. Subsequent pre-baking of the photoresist is carried out, and the process parameters of 120°C / 3min are adopted, that is, the silicon wafer after the uniform glue is placed on a baking plate with a constant temperature of 1...
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