Unlock instant, AI-driven research and patent intelligence for your innovation.

Nitride-based semiconductor module and method for manufacturing same

A technology of semiconductors and shells, which is applied in the manufacture of printed circuits, printed circuits connected with non-printed electrical components, printed circuits, etc., and can solve problems such as limiting high-frequency performance

Active Publication Date: 2022-04-22
INNOSCIENCE (SUZHOU) TECH CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additionally, the leads of leaded packages have parasitic impedance and reactance that limit high frequency performance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Nitride-based semiconductor module and method for manufacturing same
  • Nitride-based semiconductor module and method for manufacturing same
  • Nitride-based semiconductor module and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Preferred embodiments of the present disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings. Common reference numbers are used throughout the drawings and detailed description to refer to the same or like components.

[0024] Orientation designations such as "above", "below", "upward", "left", "right", relative to a particular component or group of components or a particular plane of a component or group of components for an orientation of a component as shown in the associated Figures "Down", "First", "Second", "Vertical", "Horizontal", "Side", "Higher", "Down", "Up", "Above", "Below" and other spaces describe. It should be understood that the spatial descriptions used herein are for illustration purposes only, and that actual embodiments of the structures described herein may be spatially arranged in any orientation or manner, provided that the advantages of the embodiments of the present disc...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A semiconductor module (10A) including a semiconductor device (30A) removably press-fitted in a cavity (510A) formed in a printed circuit board (50A) and a method of manufacturing the same. The cavity (510A) of the semiconductor device (30A) and the printed circuit board (50A) may mate with each other and act as an electrical plug and an electrical socket, respectively. Soldering of the semiconductor device (30A) on the printed circuit board (50A) can be avoided. Therefore, the packaging process can be more flexible, and the reliability problem of the solder joint can be eliminated.

Description

technical field [0001] The present invention generally relates to an electronic device package. More particularly, the present invention relates to a nitride-based semiconductor module including a nitride semiconductor device mounted in a printed circuit board (PCB) and a method of manufacturing the PCB and the semiconductor device. Background technique [0002] Nitride semiconductor devices such as gallium nitride (GaN) devices are prevalent in the development of semiconductor technologies and devices such as high-power switching and high-frequency applications. Typically, nitride semiconductor devices are packaged in leaded or leadless packages and assembled in printed circuit boards (PCBs) by through-hole mounting or surface-mounting. Both processes require the use of solder to provide the electrical connection between the component and the PCB. Due to the thermal expansion coefficient mismatch between the solder joint and the PCB, the solder joint can degrade and have ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/30
CPCH05K1/02H05K1/11H05K1/183H05K3/325H01L23/13H01L23/36H01L23/49811H01L24/72H01L24/19H01L24/20H01L24/96H01L2924/18162H01L2924/15153H05K1/184H05K2201/1059H05K3/403H05K2201/10727H01L23/3107H01L21/4853H01L23/3672H01L23/49844H01L24/90H05K1/021H05K1/111H05K2201/10621
Inventor 姚卫刚周春华
Owner INNOSCIENCE (SUZHOU) TECH CO LTD