High-density substrate structure and processing method thereof

Abstract

The invention relates to a high-density substrate structure and a processing method thereof, a silicon through hole chip is arranged in a hollow area of a carrier plate, a new substrate second wiring layer is arranged on a silicon through hole chip metal column convex block and a corresponding carrier plate metal column convex block, a new substrate second metal convex block is arranged on the new substrate second wiring layer, and a new substrate second metal convex block is arranged on the new substrate second wiring layer. A new substrate third wiring layer is arranged on the new substrate third wiring layer; a new substrate first wiring layer is arranged on the lower end part of the silicon through hole chip metal column and the corresponding support plate metal column bump, a new substrate first metal bump is arranged on the new substrate first wiring layer, and a new substrate fourth wiring layer is arranged on the new substrate first metal bump; and solder mask layers are arranged on the new substrate third wiring layer and the new substrate fourth wiring layer. According to the invention, the wiring density per unit area of the high-density substrate is improved, the size and the thickness are reduced, and the dielectric loss under high frequency is reduced.

Description

technical field [0001] The invention relates to the technical field of substrate processing, in particular to a high-density substrate structure and a processing method thereof. Background technique [0002] With the continuous advancement of integrated circuit technology, more and more electronic products are developing in the direction of miniaturization, lightness and intelligence. As the main packaging component of electronic chips, high-density substrates rely on their high-integration circuit density and complex and diverse customization requirements for multi-layer interconnection, which has prompted great progress in the research of high-density substrates in processing technology. [0003] Embedded substrates are an advanced technical solution in the field of packaging. IC chips, resistors or capacitors can be implanted inside the substrate. The volume of the packaged substrate is the volume of the substrate embedded with chips, so one of the technical advantages of...

AI Technical Summary

Problems solved by technology

However, due to the limitation of the capability of the traditional substrate processing technology and the fact that the larger through-hole diameter of the Core material cannot meet the processing needs of small-aperture products, the only way to increase the number of substrate layers and expand the The volume of the substrate is used to increase the terminal, which not only greatly increases the difficulty of the process, but also reduces the product yield due to the cumbersome processing process.

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