Method for removing carbon residues in production process of flexible circuit board

Abstract

The invention discloses a method for removing carbon residues in a production process of a flexible circuit board. The method comprises the following steps: setting a plasma environment; preprocessing the to-be-processed flexible board by using a plasma environment to obtain a first processed flexible board; adding ArH2 mixed gas into the plasma environment to obtain a mixed plasma environment; reprocessing the first processing flexible board by using a mixed plasma environment to obtain a second processing flexible board; and carrying out acid pickling on the second processed flexible plate to obtain a target flexible plate. Inert gas argon in ArH2 mixed gas does not react with a matrix of hydrocarbon and impacts the matrix of hydrocarbon, so that the broken bond splitting effect is achieved, and the purpose of removing carbon residues is achieved; the ArH2 mixed gas does not cause corrosion attack on polyimide or polyester film materials on the surface of the flexible circuit board, the PI film is not thinned, the phenomena of PI fatigue fracture and poor wetting of solder paste on a gold surface can be effectively avoided, and the reliability of the flexible circuit board is effectively ensured.

Description

technical field [0001] The invention relates to the technical field of flexible circuit board production, in particular to a method for removing carbon residues in the production process of flexible circuit boards. Background technique [0002] Flexible Printed Circuit (FPC or flexible board for short) is a highly reliable and excellent flexible printed circuit board made of polyimide (PI for short) or polyester film as the base material. . Flexo boards are widely used in electronic products due to their high wiring density, light weight, thin thickness, and good bendability. [0003] In the production process of flexo boards, there are often carbon residues, such as the shape processing process of flexo boards and the black shadow process (also known as the shadow process). According to the thickness and number of layers, flexible boards are divided into single-sided boards, double-sided boards and multi-layer boards (three-layer and above-layer boards). For the shape pr...

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Problems solved by technology

[0008] In view of this, the embodiment of the present invention provides a method for removing carbon residues in the production process of flexible circuit boards, so as to solve the problem of PI fatigue fracture during the bending process caused by the plasma gas and sandblasting methods for removing carbon residues in the prior art , Poor wetting of the solder paste and thinning of the PI film when assembling the solder paste

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