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Imaging element and imaging device

A technology of photographing components and substrates, which is applied in the direction of electrical components, radiation control devices, electric solid devices, etc., and can solve problems such as limitations

Pending Publication Date: 2022-05-13
NIKON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the degree of freedom in the layout of other wiring is limited due to conductive vias

Method used

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  • Imaging element and imaging device
  • Imaging element and imaging device
  • Imaging element and imaging device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0015] figure 1 It is a figure which shows the structural example of the camera 1 which is an example of the imaging apparatus of 1st Embodiment.

[0016] figure 1 Among the X direction, Y direction, and Z direction indicated by the middle arrow, the direction indicated by the arrow is referred to as the + direction. The X direction, the Y direction, and the Z direction are mutually orthogonal directions. In addition, the X direction, Y direction, and Z direction shown in the subsequent figures are also the same as figure 1 The indicated X direction, Y direction, and Z direction are the same directions.

[0017] The camera 1 includes an imaging optical system (imaging optical system) 2 , an imaging element 3 , an imaging control unit 4 , a memory 5 , a display unit 6 , and an operation unit 7 . The imaging optical system 2 includes a plurality of lenses including a focus adjustment lens (focus lens) and an aperture diaphragm, and forms a subject image on the imaging elemen...

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PUM

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Abstract

An imaging element is provided with: a first substrate provided with a photoelectric conversion unit that photoelectrically converts light and generates electric charges, and a readout circuit that outputs a signal based on the electric charges generated by the photoelectric conversion unit; a second substrate laminated on the first substrate and provided with a processing unit for processing a signal output from the readout circuit; and a connection part which is provided with a bent part that is bent at a portion other than the vicinity of the first substrate and the second substrate, and which electrically connects the readout circuit and the processing part.

Description

technical field [0001] The invention relates to a photographing element and a photographing device. Background technique [0002] Conventionally, there is known a stacked imaging element in which a first semiconductor chip on which a pixel array is formed and a second semiconductor chip on which an AD converter and a logic circuit are formed are stacked (for example, Patent Document 1). In the imaging element of Patent Document 1, each pixel in the first semiconductor chip is connected to each AD converter in the second semiconductor chip through conductive vias. However, the degree of freedom in the layout of other wiring is limited due to the conductive vias. [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Laid-Open No. 2018-182038 Contents of the invention [0006] According to a first aspect of the present invention, the imaging element includes: a first substrate provided with a photoelectric conversion unit that...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146H04N5/225H04N5/369
CPCH01L27/14634H01L27/14636H01L27/14645H01L27/14609H01L27/14612H04N23/54H04N25/79H04N25/78H01L23/522H01L21/768H01L27/146H01L24/08H01L2224/08145H04N25/75
Inventor 小仓大辉
Owner NIKON CORP