Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Flame-retardant and heat-insulating epoxy IC packaging carrier plate and preparation method thereof

A technology for encapsulating carrier boards and epoxy-based, applied in surface pretreatment bonding methods, chemical instruments and methods, lamination devices, etc., can solve the problems of poor stability of flame retardant and heat insulation performance, and achieve enhanced flame retardant Heat insulation and smoke suppression performance, improving heat insulation performance and flame retardancy, and improving the effect of flame retardancy and heat insulation performance

Pending Publication Date: 2022-05-17
江苏耀鸿电子有限公司
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing flame-retardant and heat-insulating epoxy-based IC packaging substrates, after long-term high-intensity irradiation in an acid-base environment, have poor flame-retardant and heat-insulating properties.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flame-retardant and heat-insulating epoxy IC packaging carrier plate and preparation method thereof
  • Flame-retardant and heat-insulating epoxy IC packaging carrier plate and preparation method thereof
  • Flame-retardant and heat-insulating epoxy IC packaging carrier plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The invention provides a flame-retardant and heat-insulating epoxy-based IC packaging carrier, comprising a cured sheet, an adhesive film and a metal foil, the adhesive film is located between the cured sheet and the metal foil, and the adhesive film is The percentage calculation includes: 22.40% of glass fiber, 14.40% of supplements, and 63.20% of polyamide resin; the supplement includes: 9.10% of aluminum hydroxide, 10.20% of zinc borate, 45.60% of hollow Glass beads, 5.20% butyl titanate, 5.20% glacial acetic acid, 1.20% titanate coupling agent, 8.20% phosphotungstic acid, 15.30% absolute ethanol;

[0028] The metal foil is rolled copper foil; the cured sheet is made of glass fiber cloth impregnated with epoxy resin;

[0029] The present invention also provides a method for preparing a flame-retardant and heat-insulating epoxy-based IC package carrier, the specific processing steps are as follows:

[0030] Step 1: Weigh the glass fiber in the film, polyamide resin a...

Embodiment 2

[0039] Different from Example 1, the adhesive film includes: 23.40% glass fiber, 15.40% supplement, 61.20% polyamide resin by weight percentage; the supplement includes 9.70% by weight Aluminum hydroxide, 10.80% zinc borate, 46.20% hollow glass microspheres, 5.80% butyl titanate, 5.80% glacial acetic acid, 1.80% titanate coupling agent, 8.80% phosphotungstic acid, 11.10 % absolute ethanol.

Embodiment 3

[0041] All different from Examples 1-2, the adhesive film includes: 22.90% glass fibers, 14.90% supplements, and 62.20% polyamide resin by weight percentage; the supplements include: 9.40% aluminum hydroxide, 10.50% zinc borate, 45.90% hollow glass microspheres, 5.50% butyl titanate, 5.50% glacial acetic acid, 1.50% titanate coupling agent, 8.50% phosphotungsten Acid, 13.20% absolute ethanol.

[0042] Take respectively the flame-retardant and heat-insulating epoxy-based IC package carrier of the above-mentioned embodiment 1-3, the flame-retardant and heat-insulated epoxy-based IC package carrier of the control group one, and the flame-retardant and heat-insulated carrier of the control group two. The epoxy-based IC package substrate of the control group three, the flame-retardant and heat-insulated epoxy-based IC package substrate of the control group three, the flame-retardant and heat-insulated epoxy-based IC package substrate of the control group four, and the flame-retarda...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a flame-retardant and heat-insulating epoxy IC packaging carrier plate and a preparation method thereof, and particularly relates to the technical field of IC packaging carrier plates, and the flame-retardant and heat-insulating epoxy IC packaging carrier plate comprises a curing sheet, an adhesive film and a metal foil. According to the invention, the epoxy IC packaging carrier plate can be effectively ensured to still maintain excellent flame-retardant and heat-insulating properties after being subjected to high-intensity illumination treatment in an acid environment; aluminum hydroxide and zinc borate have a synergistic effect, so that the flame-retardant and heat-insulating properties of the epoxy IC packaging carrier plate can be effectively enhanced; meanwhile, phosphotungstic acid, aluminum hydroxide and zinc borate are intercalated, blended and precipitated, so that the flame-retardant, heat-insulating and smoke-suppressing properties of the epoxy IC packaging carrier plate can be further enhanced; meanwhile, the hollow glass beads are used as a carrier of the phosphotungstic acid intercalated zinc-aluminum layered bimetal hydroxide; butyl titanate, glacial acetic acid and absolute ethyl alcohol form nano titanium dioxide modified hollow glass beads, so that the flame-retardant and heat-insulating properties of the epoxy IC packaging carrier plate are further improved.

Description

technical field [0001] The invention relates to the technical field of IC package carrier boards, more specifically, the invention relates to a flame-retardant and heat-insulating epoxy-based IC package carrier board and a preparation method thereof. Background technique [0002] IC card refers to integrated circuit card, also known as smart card, smart card, microcircuit card or microchip card. IC card packaging board refers to the key special basic material for IC card module packaging, which mainly protects the chip and acts as an interface between the integrated circuit chip and the outside world. IC card packaging boards are in the form of strips, most of which are golden yellow. According to the material of IC card packaging boards, they can be divided into two types: metal IC card packaging boards and epoxy-based IC card packaging boards. The metal IC card package carrier board is mainly used for packaging of non-contact integrated circuit card modules, while the IC ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J7/21C09J7/30C09J5/02C09J177/06C09J11/04H01L21/48H01L23/498B32B17/04B32B7/12B32B15/04B32B15/20B32B37/12B32B37/06B32B37/10
CPCC09J7/21C09J7/30C09J5/02C09J177/06C09J11/04H01L23/49866H01L23/49894H01L21/4846B32B5/02B32B7/12B32B15/14B32B15/20B32B37/12B32B37/06B32B37/10C08K2003/2227C08K2003/387C08K2003/329B32B2307/3065B32B2307/304B32B2262/101B32B2260/021B32B2260/046C08K7/14C08K3/22C08K3/38C08K3/32C08K3/36C08K7/28C08K9/12C08K13/06
Inventor 吴海兵陈应峰
Owner 江苏耀鸿电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com