Check patentability & draft patents in minutes with Patsnap Eureka AI!

Thermocompression bonding equipment for semiconductor packaging

A thermocompression bonding and semiconductor technology, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve problems such as low precision and poor stability, improve work efficiency, improve packaging quality, and prevent heat Dissipated effect

Active Publication Date: 2022-05-17
深圳市先进连接科技有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing thermocompression bonding equipment for semiconductor packaging requires heating and pressure welding for nano-silver paste. In the process of pressure adjustment, the accuracy is not high and the stability is poor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermocompression bonding equipment for semiconductor packaging
  • Thermocompression bonding equipment for semiconductor packaging
  • Thermocompression bonding equipment for semiconductor packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] see Figure 1 to Figure 7 , the present invention provides a technical solution: a thermocompression bonding equipment for semiconductor packaging, including a base plate 1, a bottom frame 2 is fixedly installed on the upper surface of the base plate 1, and a fixed bracket 13 is fixedly installed on the rear side of the bottom frame 2 , the top of the fixing bracket 13 is fixedly installed with a thermocompression bonding mechanism for semiconductor pac...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A thermocompression bonding device for semiconductor packaging disclosed by the present invention comprises a bottom plate, the upper surface of the bottom plate is fixedly provided with a bottom frame, the rear side of the bottom frame is fixedly provided with a fixed support, and the top of the fixed support is fixedly provided with a thermocompression bonding mechanism for semiconductor packaging. The hot-pressing bonding mechanism comprises a mounting frame fixedly mounted on the fixed support, a movable plate is slidably mounted on the inner wall of the mounting frame, a pressing rod is fixedly connected to the bottom of the movable plate, and the bottom end of the pressing rod extends into the bottom frame and is provided with a hot-pressing assembly; the mounting frame is further provided with a multi-stage adjusting mechanism used for changing the thermal pressure of the pressing rod. According to the invention, the semiconductor body can be subjected to hot pressing under different pressures, and the hot pressing value can be accurately adjusted.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a thermocompression bonding device for semiconductor packaging. Background technique [0002] A thermocompression bonding device is a device that separates individual semiconductor chips from a wafer, picks up the chip with the chip bottom (bump formation surface) facing down with a bonding picker, and bonds the chip to the target substrate. device. High-power semiconductor devices have high power density and high heat generation, and their own requirements for heat dissipation are very high. The thermal conductivity of solder materials used for packaging high-power semiconductor devices has a great influence on the heat dissipation capability of devices, so ultra-high thermal conductivity solder materials have become an important direction for research and development. Nano-silver paste solder is the focus of development in the industry in recent years. The ex...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/603
CPCH01L21/67144H01L24/80H01L2224/80203
Inventor 靳清岑玮姜亮王苍来吴昊
Owner 深圳市先进连接科技有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com