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Tail gas exhaust system, exhaust method and semiconductor equipment

A technology of exhaust and suction system and exhaust gas, which is used in semiconductor/solid-state device manufacturing, electrical components, program-controlled manipulators, etc., can solve problems such as low production efficiency, and achieve the effect of simple structure, good exhaust gas removal effect, and prevention of by-products.

Pending Publication Date: 2022-05-27
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above analysis, the present invention aims to provide an exhaust gas removal system, removal method and semiconductor equipment to solve the problem of low production efficiency caused by replacing the end effector arm to prevent by-products from flying onto the wafer in the prior art

Method used

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  • Tail gas exhaust system, exhaust method and semiconductor equipment
  • Tail gas exhaust system, exhaust method and semiconductor equipment
  • Tail gas exhaust system, exhaust method and semiconductor equipment

Examples

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Embodiment 1

[0047] A specific embodiment of the present invention discloses a tail gas removal system, which is used to discharge the tail gas used in the process and remaining on the surface of the wafer. like figure 1 As shown in the figure, the exhaust gas removal system includes a plurality of micropores 1 arranged on the surface of the end effector arm and an exhaust gas suction system communicated with the micropores on the surface of the end effector arm. -Split), solenoid valve 3, pneumatic valve 4, discharge line and air extraction device (not shown in the figure).

[0048] It should be noted that, since the purpose of arranging the micro-holes is to remove the residual gas adsorbed on the surface of the wafer, the arrangement position of the micro-holes needs to be close to the wafer. Therefore, the preferred embodiment is to place the micro-holes on the surface of the end effector arm.

[0049] In a possible implementation manner, the region with micro-holes on the end effect...

Embodiment 2

[0062] Yet another embodiment of the present invention discloses a method for removing exhaust gas using the exhaust gas removal system of the first embodiment. The exhaust gas removal process will be described in detail below.

[0063] First, in the standby state of the equipment, turn on the exhaust gas removal system to exhaust for a certain period of time, the exhaust gas is sucked through a plurality of micropores on the surface of the end effector arm, mixed in the inner cavity of the multi-branch mixing chamber, and then passed through the second The exhaust line enters the atmosphere transfer module. The exhaust gas removal time depends on the situation, generally a few seconds to tens of minutes.

[0064] As for the timing of turning on the exhaust gas removal system, it can also be turned on when a wafer is placed on the end effector arm. Alternatively, turn on the exhaust gas removal system when the semiconductor manufacturing equipment is idle.

[0065] Next, th...

Embodiment 3

[0069] Another embodiment of the present invention discloses a semiconductor device including the exhaust gas removal system of the first embodiment.

[0070] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0071] (1) The present invention does not solve the problem that the by-products are scattered on the wafer and cause defects in the wafer by replacing the end-effector arm after the by-product is generated, but through structural improvement (that is, setting micro-holes on the surface of the end-effector arm) ) Exhaust exhaust gas to prevent the generation of by-products, and fundamentally solve the problem of wafer defects caused by by-products scattered on the wafer.

[0072] (2) The tail gas removal system of the present invention has a simple structure and good effect of tail gas removal, and the product yield is improved after using the tail gas removal system.

[0073] (3) By controlling the diamete...

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Abstract

The invention relates to a tail gas exhaust system, an exhaust method and semiconductor equipment, belongs to the technical field of semiconductor manufacturing, and solves the problem of low production efficiency caused by a mode of preventing byproducts from flying onto a wafer by replacing a tail end execution arm in the prior art. The tail gas exhaust system comprises a plurality of micropores formed in the surface of the tail end execution arm, a multi-branch mixing cavity, a control valve and an exhaust pipeline, the exhaust pipeline comprises a first exhaust pipeline located in the tail end execution arm and a second exhaust pipeline located outside the tail end execution arm, and a gas outlet and a plurality of gas inlets are formed in the multi-branch mixing cavity; the number of the air inlet holes is the same as that of the micropores, the micropores and the air inlet holes are connected through a first discharge pipeline, gas of the multiple micropores is collected in the multi-branch mixing cavity, and the air outlet holes and the control valve are connected through a second discharge pipeline. According to the invention, the generation of byproducts is fundamentally prevented.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, and in particular, to an exhaust gas removal system, a removal method and semiconductor equipment. Background technique [0002] During semiconductor manufacturing, in the reaction chambers such as Cl 2 , HBr, BCl 3 In the process of picking up wafers from the pre-vacuum chamber (Airlock) by the end effector arm of the atmospheric transfer module robot after the process, and opening the wafer cassette ( When the FOUP is moving, the exhaust gas on the wafer surface is directly exposed to the atmosphere, and reacts with the moisture in the atmosphere to form by-products. When the robot of the atmospheric transmission module moves rapidly, the by-products randomly scatter, causing defects on the wafer and causing quality problems. At the same time, the by-products generated will contaminate the end effector, and the current semiconductor manufacturing equipment does not have an...

Claims

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Application Information

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IPC IPC(8): H01L21/67B25J9/12B25J9/16B25J19/00
CPCH01L21/67011B25J9/12B25J9/1679B25J19/00
Inventor 李相龙李俊杰李琳王佳周娜
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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