Signal line electromigration inspection method and device, electronic equipment and storage medium

Abstract

A signal line electromigration inspection method, a signal line electromigration inspection apparatus, an electronic device, and a non-transitory computer readable storage medium. The signal line electromigration inspection method is applied to an integrated circuit design, the integrated circuit design comprises a top design and a plurality of sub-designs, and the signal line electromigration inspection method comprises the following steps: generating a plurality of boundary model files in one-to-one correspondence with the plurality of sub-designs, each boundary model file comprises description information of a plurality of interaction elements in the sub-design corresponding to the boundary model file, and the plurality of interaction elements are used for realizing interaction between the sub-design and the top design and / or the sub-design except the sub-design corresponding to the boundary model file in the plurality of sub-designs; obtaining a description file corresponding to the top design; and performing signal line electromigration inspection on the top design based on the plurality of boundary model files and the description file corresponding to the top design.

Description

technical field [0001] Embodiments of the present disclosure relate to a signal line electromigration inspection method, a signal line electromigration inspection apparatus, an electronic device, and a non-transitory computer-readable storage medium. Background technique [0002] With the continuous progress of the preparation process, the increase of the process accuracy, the continuous reduction of the process line width, the continuous increase of the integration degree of the chip design, the gradual increase of the current density per unit line width, and the reliability requirements for the signal line electromigration inspection of the chip. Both scale and iteration time presented serious challenges. SUMMARY OF THE INVENTION [0003] At least one embodiment of the present disclosure provides a signal line electromigration inspection method, which is applied to an integrated circuit design, wherein the integrated circuit design includes a top-level design and a plura...

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Problems solved by technology

[0002] With the continuous improvement of the manufacturing process, the process precision increases, the process line width continues to decrease, the integration level of chip design continues to increase, and the current density per unit line width gradually increases. Reliability requirements for chip signal line electromigration inspection Scale and iteration time present serious challenges

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