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Preparation method of hole functional layer and preparation method of quantum dot light-emitting diode

A technology of quantum dot luminescence and functional layer, applied in photovoltaic power generation, semiconductor/solid-state device manufacturing, electric solid-state device, etc., can solve the problem of high annealing temperature, reduce thermal damage, improve luminous efficiency and stability

Pending Publication Date: 2022-06-03
TCL CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of this application is to provide a method for preparing a hole functional layer and a method for preparing a quantum dot light-emitting diode, aiming at solving the technical problem that the annealing temperature is too high when the hole function material is formed into a film

Method used

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  • Preparation method of hole functional layer and preparation method of quantum dot light-emitting diode
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preparation example Construction

[0017] The present application provides a method for preparing a hole functional layer, such as Figure 1 As shown, the preparation method comprises the following steps:

[0018] S01: Solution of deposited cavitation functional materials;

[0019] S02: Annealing was carried out under the condition of ≤120 °C to obtain the hole functional layer,

[0020] Wherein, the solvent in the cavitation functional material solution comprises a first solvent and a second solvent, the boiling point of the second solvent is lower than the boiling point of the first solvent.

[0021]The preparation method of the hole functional layer provided in the present application, the solution for forming the cavity functional material for film formation is selected comprising a mixed solvent of the first solvent and the second solvent, because the boiling point of the second solvent is lower than the boiling point of the first solvent, so that the dew point of the cavity functional material solution is redu...

Embodiment 1

[0041] A quantum dot light-emitting diode, from bottom to top, includes: anode, hole transport layer, quantum dot light emitting layer, electron transport layer and cathode. The preparation of the hole transport layer of this quantum dot LED consists of the following steps:

[0042]TFB is dissolved in a mixed solvent composed of n-hexane and chlorobenzene to give a solution of the hole transport material; The volume ratio of n-hexane and chlorobenzene is 1:4. The above hole transport material solution is deposited on the anode, annealed at 120 °C for 30 min, and the hole transport layer is obtained.

[0043] Because the boiling point under atmospheric pressure of n-hexane is 69 °C, the dew point temperature of the mixed solution is reduced after mixing with chlorobenzene, so that the annealing temperature of the hole transport layer is reduced.

Embodiment 2

[0045] A quantum dot light-emitting diode, from bottom to top, includes: cathode, electron transport layer, quantum dot light emitting layer, hole transport layer and anode. The preparation of the hole transport layer of this quantum dot LED consists of the following steps:

[0046] PVK is dissolved in a mixed solvent composed of n-pentane and chlorobenzene to give a solution of the cavity transport material; Among them, the volume ratio of n-pentane and chlorobenzene is 1:1. The above hole transport material solution is deposited on the quantum dot luminescent layer, annealed at 70 °C for 30 min, and the hole transport layer is obtained.

[0047] The boiling point of n-pentane under atmospheric pressure is 36.1 °C, and the dew point temperature of the mixed solution is reduced after mixing with chlorobenzene, so that the annealing temperature of the hole transport layer is reduced.

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Abstract

The invention relates to the technical field of display device processes, in particular to a preparation method of a hole function layer and a preparation method of a quantum dot light-emitting diode. The preparation method of the hole functional layer comprises the following steps: depositing a hole functional material solution; the hole function material solution is subjected to annealing treatment under the condition that the temperature is smaller than or equal to 120 DEG C, a hole function layer is obtained, solvents in the hole function material solution comprise a first solvent and a second solvent, and the boiling point of the second solvent is lower than that of the first solvent. The hole function material solution for film forming is a mixed solvent comprising a first solvent and a second solvent, and the boiling point of the second solvent is lower than that of the first solvent, so that the film forming annealing temperature of the hole function material solution is remarkably reduced, and the hole function material solution can be annealed under the condition that the temperature is less than or equal to 120 DEG C and is far lower than the current annealing temperature; therefore, the thermal damage of the hole function layer can be reduced, and the performance of the hole function layer is improved.

Description

Technical field [0001] The present invention belongs to the field of display device process technology, specifically relates to a method for preparing a hole functional layer and a method for preparing a quantum dot light emitting diode. Background [0002] Quantum dot display technology relies on the independent luminescence of red, green and blue pixels. At present, the typical structure of QuantumDot Light Emitting Diode (QLED) devices is a "sandwich" structure, which is mainly composed of a glass substrate, a hole function layer, a quantum dot light emitting layer, an electronic function layer, and an electrode. Based on the characteristics of quantum dots and the economy of industrial pursuit, the preparation process of quantum dot devices is commonly used by solution method, by dissolving each functional layer material in a suitable solvent, and then spinning or inkjet printing to prepare the corresponding film. [0003] At present, the annealing temperature is high when pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/50H01L51/56
CPCH10K71/40H10K50/115H10K50/15H10K50/17H10K71/00Y02E10/549
Inventor 姚振垒
Owner TCL CORPORATION