Transparent resin composition, flexible copper-clad plate containing transparent resin composition and application of flexible copper-clad plate

A technology of flexible copper clad laminate and transparent resin, applied in the field of transparent resin composition and flexible copper clad laminate, can solve the problems of inability to obtain transparent conductive materials, decrease in visible light transmittance, increase in reflectivity of adhesive layer, etc., and achieve excellent phase performance. Capacitance and transparency, excellent transparency, good touch stickiness

Active Publication Date: 2022-07-08
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Currently commonly used adhesives include epoxy resin adhesives, silicone adhesives or polyurethane adhesives, etc. However, when the metal grid is prepared by subtractive etching, the contact between the copper foil and the adhesive layer will make the surface of the adhesive layer rough after the copper clad laminate is etched, making the light Diffuse reflection is formed on the adhesive surface, resulting in an increase in the reflectivity of the adhesive layer and a decrease in visible light transmittance, making it impossible to obtain transparent conductive materials

Method used

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  • Transparent resin composition, flexible copper-clad plate containing transparent resin composition and application of flexible copper-clad plate
  • Transparent resin composition, flexible copper-clad plate containing transparent resin composition and application of flexible copper-clad plate

Examples

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Embodiment 1

[0073] This embodiment provides a transparent resin composition, comprising the following components in parts by weight: 50 parts of polyacrylate resin (SG-280TEA from Nagase ChemteX, Japan), 20 parts of thermoplastic polyurethane resin (Estane 58271) and novolac epoxy resin 2 parts of resin.

[0074] This embodiment also provides a flexible copper clad laminate, comprising a base film (PET film, 100 μm), a resin layer (5 μm) and a copper foil (2 μm) arranged in sequence; the preparation method is as follows:

[0075] (1) The transparent resin composition described in this embodiment is mixed with methyl ethyl ketone and dispersed uniformly to obtain a resin glue solution with a solid content of 40%;

[0076] (2) Coating the resin glue obtained in step (1) on the surface of the PET film, drying at 80°C for 2 minutes; then compounding with copper foil at 70°C, and curing at 80°C for 5 hours to obtain the Flexible CCL.

Embodiment 2

[0078] This embodiment provides a transparent resin composition, which includes the following components in parts by weight: 65 parts of polyacrylate resin (SG-600TEA from Nagase ChemteX, Japan), 30 parts of thermoplastic polyurethane resin (Estane 58271) and bisphenol A type 3 parts of novolac epoxy resin.

[0079] This embodiment also provides a flexible copper clad laminate, including a base film (PEN film, 200 μm), a resin layer (15 μm) and a copper foil (6 μm) arranged in sequence; the preparation method is as follows:

[0080] (1) The transparent resin composition described in this embodiment is mixed with toluene and dispersed uniformly to obtain a resin glue with a solid content of 50%;

[0081] (2) Coating the resin glue obtained in step (1) on the surface of the PEN film, drying at 100°C for 5 minutes; then compounding with copper foil at 90°C, and then curing at 100°C for 3 hours to obtain the Flexible CCL.

Embodiment 3

[0083] This embodiment provides a transparent resin composition, which includes the following components in parts by weight: 80 parts of polyacrylate resin (SG-790 from Nagase ChemteX, Japan), 40 parts of thermoplastic polyurethane resin (Estane 58271) and o-cresol type 5 parts of novolac epoxy resin.

[0084] This embodiment also provides a flexible copper clad laminate, comprising a base film (CPI film, 50 μm), a resin layer (30 μm) and a copper foil (9 μm) arranged in sequence; the preparation method is as follows:

[0085] (1) The transparent resin composition described in this embodiment is mixed with cyclohexanone and uniformly dispersed to obtain a resin glue with a solid content of 60%;

[0086] (2) Coating the resin glue solution obtained in step (1) on the surface of the CPI film, drying at 120°C for 3 minutes; then compounding with copper foil at 80°C, and then curing at 90°C for 4 hours to obtain the Flexible CCL.

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Abstract

The invention provides a transparent resin composition, a flexible copper-clad plate containing the transparent resin composition and application of the flexible copper-clad plate. The transparent resin composition comprises the following components in parts by weight: 50-80 parts of polyacrylate, 20-40 parts of thermoplastic polyurethane and 2-5 parts of epoxy resin. According to the transparent resin composition, through screening of polymers and compounding of the components, the light transmittance and the bonding strength are improved, the chemical resistance is good, and the transparent resin composition has the characteristics of proper flexibility, tackiness and hot-pressing softening and leveling after curing. The flexible copper-clad plate containing the transparent resin composition has high peel strength and chemical resistance, can meet the etching requirements of low line width and high precision, still shows excellent transparency after etching, and is especially suitable for large-screen touch products.

Description

technical field [0001] The invention belongs to the technical field of copper clad laminates, and particularly relates to a transparent resin composition, a flexible copper clad laminate comprising the same, and applications thereof. Background technique [0002] In recent years, large-screen touch products have been widely used in modern education, business conferences, advertising exhibitions and other fields. Large-screen touch products are mainly divided into infrared touch screens and capacitive touch screens. Among them, the infrared touch screen is not disturbed by factors such as current, voltage and static electricity, and can be effectively explosion-proof and dust-proof. It has a long service life and is suitable for large-scale preparation. It is a relatively mature touch technology on the market. However, infrared touch is easily interfered by strong infrared objects such as remote controls, high-temperature objects, incandescent lamps, and sunlight, and is very...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L33/04C08L75/04C08L63/04B32B7/12B32B15/08B32B15/09B32B15/20B32B27/28B32B27/36G06F3/041G06F3/044
CPCC08L33/04B32B15/20B32B15/09B32B27/36B32B7/12B32B15/08B32B27/281G06F3/0416G06F3/044C08L2201/10C08L2205/03B32B2255/10B32B2255/26G06F2203/04103C08L75/04C08L63/04
Inventor 左陈茹敬宏伍宏奎薛以辉
Owner GUANGDONG SHENGYI SCI TECH
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