Photosensitive resin, photosensitive resin composition, cured product, pattern forming method, and integrated circuit device
A technology of photosensitive resin and composition, which can be used in optics, instruments, optomechanical equipment, etc., and can solve problems such as poor solubility and insufficient photosensitivity
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Embodiment 1
[0202] Under the protection of inert gas, 0.014mol of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl was dissolved in a polar solvent (24ml), to which was added p-diaminoazobenzene 0.014mol of the mixed diamine solution was prepared; 0.028mol of pyromellitic dianhydride was added to the mixed solution in several portions, and the reaction was carried out at 200° C. for 4 hours. After the reaction, the solution was cooled to room temperature and then placed in water to obtain a white precipitate, which was washed and dried to obtain the target resin.
[0203] To the resin synthesized above, 0.002 mol of ethylene glycol acrylate, 20 ml of γ-butyrolactone, and 0.002 mol of azido naphthoquinone-5-sulfonic acid were added to obtain a photosensitive resin composition.
[0204] The photosensitive polyimide composition prepared above was spin-coated on a silicon wafer (1200 rpm, 30 seconds), and the photosensitive polyimide composition coated on the wafer was dried on a hot plate at 1...
Embodiment 2
[0206] Under the protection of inert gas, 0.014mol of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl was dissolved in a polar solvent (24ml), to which was added p-diaminoazobenzene 0.028 mol of the mixed diamine solution was prepared; 0.042 mol of pyromellitic dianhydride was added to the mixed solution in several portions, and the reaction was carried out at 200° C. for 4 h. After the reaction, the solution was cooled to room temperature and then placed in water to obtain a white precipitate, which was washed and dried to obtain the target resin.
[0207] To the resin synthesized above, 0.003 mol of ethylene glycol acrylate, 30 ml of γ-butyrolactone, and 0.003 mol of azide naphthoquinone-5-sulfonic acid were added to obtain a photosensitive resin composition.
[0208] The photosensitive polyimide composition prepared above was spin-coated on a silicon wafer (1200 rpm, 30 seconds), and the photosensitive polyimide composition coated on the wafer was dried on a hot plate at 100...
Embodiment 3
[0210] Under the protection of inert gas, 0.014mol of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl was dissolved in a polar solvent (24ml), to which was added p-diaminoazobenzene 0.042 mol of the mixed diamine solution was prepared; 0.056 mol of pyromellitic dianhydride was added to the mixed solution in multiple portions, and the reaction was carried out at 200° C. for 4 h. After the reaction, the solution was cooled to room temperature and then placed in water to obtain a white precipitate, which was washed and dried to obtain the target resin.
[0211] To the resin synthesized above, 0.004 mol of ethylene glycol acrylate, 40 ml of γ-butyrolactone, and 0.004 mol of azido naphthoquinone-5-sulfonic acid were added to obtain a photosensitive resin composition.
[0212] The photosensitive polyimide composition prepared above was spin-coated on a silicon wafer (1200 rpm, 30 seconds), and the photosensitive polyimide composition coated on the wafer was dried on a hot plate at 10...
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