Conductive resin composition for slip prevention and molded article comprising same

A conductive resin and resin molding technology, applied in the field of conductive resin compositions and molded products containing the same, can solve problems such as limitations, and achieve the effects of low surface resistance, improved processability and production efficiency, and simple processing methods

Pending Publication Date: 2022-07-08
HANWHA SOLUTIONS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Only, as stated in the patent, when using antistatic agent or antistatic agent, the surface resistance is 10 10 High resistance above Ω / sq, therefore, slightly limited in providing excellent antistatic properties

Method used

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  • Conductive resin composition for slip prevention and molded article comprising same
  • Conductive resin composition for slip prevention and molded article comprising same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031]

[0032] The preparation comprises 100 parts by weight of adhesive resin (80 parts by weight of Hanwha Solutions EVA 1834, 20 parts by weight of Dow Engage 8137POE), 2 parts by weight of carbon nanotubes (CNT), 8 parts by weight of carbon black (carbon black) black), 0.1 parts by weight of antioxidants (hindered phenols), and 0.3 parts by weight of processing aids (fatty acid amides).

[0033] After filling the prepared conductive resin composition for slip resistance in the cavity of a mold, pressurizing it with a press, cooling and solidifying, a molded product (sheet) is produced.

Embodiment 2

[0035] The same procedure as in Example 1 was carried out except that 100 parts by weight of an adhesive resin (20 parts by weight of Hanwha Solutions EVA 1834, 80 parts by weight of Dow Engage 8137POE) were used.

Embodiment 3

[0037] The same procedure as in Example 1 was carried out except that 100 parts by weight of an adhesive resin (20 parts by weight of Hanwha Solutions EVA 1834, 80 parts by weight of Dow FLEXOMER DFDB-9042NT VLDPE) was used.

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Abstract

The present invention relates to a conductive resin composition having an anti-slip function and a molded article comprising the same, which are different from the prior art in which an adhesive is applied for anti-slip or an antistatic agent is added for imparting conductivity, and which comprise an adhesive resin capable of providing high surface friction and a carbon filler to provide low surface resistance, and a molded article comprising the same, and more particularly, to a conductive resin composition having an anti-slip function and a molded article comprising the same. Thus, a technique of excellent conductivity is provided.

Description

technical field [0001] The present invention relates to a conductive resin composition having an anti-slip function and a molded article containing the same, which is different from the conventional methods of coating an adhesive for anti-slipping or adding an antistatic agent to impart conductivity, and relates to a conductive resin composition capable of providing High surface friction adhesive resin and carbon filler material to provide low surface resistance, thus providing excellent electrical conductivity technology. Background technique [0002] In modern society, the use of electronic products such as mobile phones, televisions, and computers is indispensable, and their development speed and styles are changing rapidly. In order to manufacture these electronic products, various electronic devices are used, and, in order to rapidly mass-produce electronic products, most of them are carried out in an automated process. At this time, trays used in automated processes f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K3/04
CPCC08K3/04C08K3/041C08K3/042C08L101/00C08K2201/001
Inventor 康喆伊李相振李相旭张在奎
Owner HANWHA SOLUTIONS CORP
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