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Polymer composition for laser direct structuring

A technology of polymers and compositions, applied in independent non-interactive antenna combinations, printed circuits, printed circuit manufacturing, etc., can solve the adverse effects of composition mechanical properties deformation temperature, difficult laser direct forming process, high dielectric constant And other issues

Pending Publication Date: 2022-07-08
TICONA LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, one problem with such materials is that flame retardants tend to adversely affect the mechanical properties of the composition, such as deformation temperature under load, making it difficult to use in laser direct structuring processes
Liquid crystal polymer formulations have been developed in an attempt to address these issues, but these formulations often have too high a dielectric constant to make them suitable for high frequency applications with increased power consumption and heat generation (e.g. 5G)

Method used

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  • Polymer composition for laser direct structuring
  • Polymer composition for laser direct structuring
  • Polymer composition for laser direct structuring

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0115] Samples 1 to 7 consist of liquid crystal polymers (LCP 1 and LCP 2), copper chromite filler (CuCr 2 O 4 ), glass fibers, alumina trihydrate (ATH), lubricants (polyethylene wax), and polytetrafluoroethylene (PTFE 1 and PTFE 2) in various combinations. LCP 1 was formed from 43% HBA, 20% NDA, 9% TA and 28% HQ. LCP 2 is formed from 60% HBA, 4% HNA, 18% TA and 18% BP. PTFE 1 is a polytetrafluoroethylene particle powder with a D50 particle size of 4 μm, and PTFE 2 is a polytetrafluoroethylene particle powder with a D50 particle size of 40 μm. Compounding was performed using an 18mm single screw extruder. Parts are injection moulded samples into panels (60mm x 60mm).

[0116] Table 1

[0117] 1 2 3 4 5 6 7 LCP 1 77.6 78 80 73 68 73 68 LCP 2 17.6 - - - - - - glass fiber 15 15 13 15 15 15 15 Alumina trihydrate 0.2 0.2 0.2 0.2 0.2 0.2 0.2 lubricant 0.2 0.2 0.2 0.2 0.2 0.2 0.2 copper chromite 4...

Embodiment 2

[0122] Sample 8 was formed from liquid crystal polymers (LCP 2 and LCP 3, hollow glass spheres, glass powder, glass fibers, and alumina trihydrate. LCP 3 was formed from 48% HNA, 2% HBA, 25% BP, and 25% TA. As in The glass powder had a dielectric constant of 4.8 measured at 1 GHz. Compounding was performed using a 25 mm single screw extruder.

[0123] table 3

[0124] sample 8 LCP 3 49.8 LCP 2 15.4 hollow glass ball 17.0 glass powder 1.0 Fiberglass (4mm long) 10.0 Alumina trihydrate 0.2 copper chromite 6.6

[0125] The thermal and mechanical properties of the samples were tested. The results are described in Table 4 below.

[0126] Table 4

[0127] sample 8 Dielectric constant (2GHz) 3.07 Dissipation Factor (2GHz) 0.0043 Dielectric constant (10GHz) 3.14 Dissipation Factor (10GHz) 0.0035 1000s -1 Melt Viscosity (Pa-s) under

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Abstract

A laser activatable polymer composition is provided. The composition comprises at least one laser-activatable additive and at least one high cycloalkene thermotropic liquid crystal polymer containing recurring units derived from cycloalkene hydroxycarboxylic acids and / or cycloalkene dicarboxylic acids in an amount of about 10 mol.% or more. The polymer composition exhibits a dielectric constant of about 5 or less as determined at a frequency of 2 GHz.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS [0002] This application claims the benefit of the following applications: US Provisional Patent Application Serial No. 62 / 898,188, filed September 10, 2019; US Provisional Patent Application Serial No. 62 / 925,274, filed October 24, 2019 Patent Application; US Provisional Patent Application Serial No. 62 / 951,039, filed December 20, 2019; US Provisional Patent Application, Serial No. 62 / 972,195, filed February 10, 2020; US Provisional Patent Application Serial No. 62 / 994,329, filed March 25, 2020; US Provisional Application Serial No. 63 / 009,017, filed April 13, 2020; filed May 14, 2020 US Provisional Application Serial No. 63 / 024,584; and US Provisional Application Serial No. 63 / 056,865, filed July 27, 2020, the entire contents of which are incorporated herein by reference in their entirety. Background technique [0003] To form antenna structures for various electronic assemblies, Molded Interconnect Devices (MIDs) typically co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L67/04
CPCC08G63/605C08L67/03C08K2003/2227C08K2003/2251C08K3/346H05K3/105H05K1/0326H05K2201/0141H05K2203/107C08K3/22C08K7/14C08L27/18C08K7/20C08G63/19C08G63/191C08G63/193C08G63/189C08G63/065C08L67/04C08K7/22C08K3/34H01Q1/2291H05K2203/0104C08G63/183H05K3/0026H01Q21/28C08G2250/00C08K2201/001
Inventor 金荣申张小伟
Owner TICONA LLC