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Benzoxazine resin, preparation method thereof and resin composition

A technology of resin composition and benzoxazine, which is applied in the field of benzoxazine resin and its preparation method and resin composition, can solve the problems of large dielectric loss of printed circuit boards and inability to meet the requirements of high-frequency printed circuit boards, etc. , to achieve good heat resistance and dielectric properties

Pending Publication Date: 2022-07-19
NANYA PLASTICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the dielectric loss of printed circuit boards made of this benzoxazine resin is greater than 0.008, which cannot meet the requirements of high-frequency printed circuit boards
Therefore, the benzoxazine resins currently on the market still need to be improved

Method used

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  • Benzoxazine resin, preparation method thereof and resin composition
  • Benzoxazine resin, preparation method thereof and resin composition
  • Benzoxazine resin, preparation method thereof and resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0056] A temperature controller, heating pack, electric stirrer, and condenser were set up on a four-neck glass reaction tank with a capacity of one liter. 76.5 g (including 0.45 moles of hydroxyl groups) of dicyclopentadiene phenol resin, 63 g (including 0.55 moles of hydroxyl groups) of phenolic methane, 31.6 g (including 0.45 moles of amine groups) of methylene chloride were added to the four-neck glass reaction tank. Xylylenediamine, 66 grams (containing 0.55 moles of amine groups) of 2,6-dimethylaniline, and 460 grams of toluene (solvent), and the four-neck glass reaction tank was heated to 60 to 100 ° C to allow the reaction material dissolves.

[0057] Next, 67 g (2.1 mol) of polyoxymethylene is added to the four-neck glass reaction tank, and a condensation polymerization reaction is performed at a temperature of 60 to 100°C for 1 to 5 hours. After the reaction is completed, the temperature is maintained at a temperature of 60 to 100 ° C for 4 to 10 hours, and then hea...

Synthetic example 2

[0060] A temperature controller, heating pack, electric stirrer, and condenser were set up on a four-neck glass reaction tank with a capacity of one liter. 31 g (including 0.18 moles of hydroxyl groups) of dicyclopentadiene phenol resin, 93.5 g (including 0.82 moles of hydroxyl groups) of phenolic methane, and 31.6 g (including 0.45 moles of amine groups) of phenol were added to the four-neck glass reaction tank. Xylylenediamine, 66 grams (containing 0.55 moles of amine groups) of 2,6-dimethylaniline, and 460 grams of toluene (solvent), and the four-neck glass reaction tank was heated to 60 to 100 ° C to allow the reaction material dissolves.

[0061] Next, 67.3 g (2.1 mol) of polyoxymethylene was added to the four-neck glass reaction tank, and a condensation polymerization reaction was performed at a temperature of 60 to 100° C. for 1 to 5 hours. After the reaction is completed, the temperature is maintained at a temperature of 60 to 100 ° C for 4 to 10 hours, and then the t...

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Abstract

The invention discloses benzoxazine resin, a preparation method thereof and a resin composition. The benzoxazine resin is prepared by taking a phenolic compound, formaldehyde and a primary amine compound as reactants through condensation polymerization reaction. Wherein the phenolic compound comprises dicyclopentadiene phenol resin and phenol methane, and the primary amine compound comprises 2, 6-dimethylaniline and m-xylylenediamine. The resin composition includes a benzoxazine resin, an epoxy resin, and a bismaleimide resin. Wherein the total weight of the benzoxazine resin, the epoxy resin and the bismaleimide resin is 100 parts by weight, and the content of the benzoxazine resin is 30-50 parts by weight. The benzoxazine resin disclosed by the invention can be used as a material of a copper foil substrate, and has the characteristics of good heat resistance, low water absorption, low dielectric constant and low dielectric loss.

Description

technical field [0001] The present invention relates to a kind of benzoxazine resin and its preparation method and resin composition, especially relate to a kind of benzoxazine resin with good dielectric properties and heat resistance, its preparation method and resin composition. Background technique [0002] With the advancement of technology, electronic components are developing towards the goal of being light, thin, short and small. Moreover, the advent of the 5th generation mobile networks (5G for short) makes the industry's demands for high frequency transmission, high-speed signal transmission, and low latency continue to increase. Therefore, at present, the related fields are devoted to the research and development of substrate materials with high glass transition temperature (Tg), low dielectric constant, low dielectric loss and good heat resistance, so as to meet the requirements of electronic substrates for dielectric properties (low dielectric constant, low diel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G14/073C08L79/08C08L61/34C08L63/04
CPCC08G14/06C08L79/085C08L2205/035C08L2205/025C08L2201/08C08L61/34C08L63/04C08G73/06C08L2205/03C08L79/04C08L79/02C08G73/0233
Inventor 李政中吴振华彭郁翔魏玮廷
Owner NANYA PLASTICS CORP