Phase-change nanocapsule composite material with enhanced heat conductivity as well as preparation method and application of phase-change nanocapsule composite material

A technology of nanocapsules and composite materials, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of unstirable rubber materials and uneven dispersion of polymers, and achieve reduced material hardness, high thermal conductivity, and large Effect of specific surface area on heat transfer

Pending Publication Date: 2022-07-22
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the purpose of the present invention is to provide a phase-change nanocapsule composite material with enhanced thermal conductivity and its preparation method and application. The phase-change nanocapsule and high thermal conductivity material are introduced into the polymer matrix, which solves the problems of the prior art. Medium phase change nanocapsules and high thermal conductivity materials jointly introduce the problem of uneven dispersion of polymers, especially when the amount of fillers is high, it often occurs that the rubber cannot be stirred, and it is easy to appear in the microscopic state of the material after molding. Reunion morphology

Method used

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  • Phase-change nanocapsule composite material with enhanced heat conductivity as well as preparation method and application of phase-change nanocapsule composite material
  • Phase-change nanocapsule composite material with enhanced heat conductivity as well as preparation method and application of phase-change nanocapsule composite material
  • Phase-change nanocapsule composite material with enhanced heat conductivity as well as preparation method and application of phase-change nanocapsule composite material

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Effect test

Embodiment 1

[0033] A thermal conductivity-enhanced phase-change nanocapsule composite material, calculated in mass fraction, is made from the following raw materials: inorganic shell phase-change nanocapsules 10.53%, high thermal conductivity filler boron nitride 31.58%, polydimethylsiloxane pre- Polymer 52.63% and hydrogen silicone oil 5.26%.

[0034]The preparation method of the phase-change nanocapsule composite material with enhanced thermal conductivity comprises the following steps:

[0035] (1) The phase-change nanocapsules with paraffin as the core material and silica as the shell material were prepared by the interfacial hydrolysis-polycondensation method: paraffin (15.0g), tetraethyl orthosilicate TEOS (7.5g) were placed in a 250mL three-necked flask with Stir and mix at 60°C to form a clear solution. Then, simultaneously, cetyltrimethylammonium bromide CTAB (0.82 g), deionized water (35.5 mL) and absolute ethanol (71.25 mL) were added to a 250 mL beaker and incubated to 60°C. ...

Embodiment 2

[0042] A thermal conductivity-enhanced phase-change nanocapsule composite material, calculated in mass fraction, is made from the following raw materials: inorganic shell phase-change nanocapsules 19.05%, high thermal conductivity filler boron nitride 28.57%, polydimethylsiloxane pre- Polymer 47.62% and hydrogen siloxane 4.76%.

[0043] The preparation method of the phase-change nanocapsule composite material with enhanced thermal conductivity comprises the following steps:

[0044] (1) The phase-change nanocapsules with paraffin as the core material and silica as the shell material were prepared by the interfacial hydrolysis-polycondensation method: paraffin (15.0g), tetraethyl orthosilicate TEOS (7.5g) were placed in a 250mL three-necked flask with Stir and mix at 60°C to form a clear solution. Then, simultaneously, cetyltrimethylammonium bromide CTAB (0.82 g), deionized water (35.5 mL) and absolute ethanol (71.25 mL) were added to a 250 mL beaker and incubated to 60°C. Th...

Embodiment 3

[0051] A thermal conductivity-enhanced phase-change nanocapsule composite material, calculated in mass fraction, is made from the following raw materials: inorganic shell phase-change nanocapsules 26.09%, high thermal conductivity filler boron nitride 26.09%, polydimethylsiloxane pre- Polymer 43.47% and methyl hydrogen silicone oil 4.35%.

[0052] The preparation method of the phase-change nanocapsule composite material with enhanced thermal conductivity comprises the following steps:

[0053] (1) The phase change nanocapsules with paraffin as the core material and silica as the shell material were prepared by the interfacial hydrolysis-polycondensation method: paraffin (15.0g), tetraethyl orthosilicate TEOS (7.5g) were placed in a 250mL three-neck flask with Stir and mix at 60°C to form a clear solution. Then, simultaneously, cetyltrimethylammonium bromide CTAB (0.82 g), deionized water (35.5 mL) and absolute ethanol (71.25 mL) were added to a 250 mL beaker and incubated to ...

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Abstract

The invention discloses a heat-conduction-enhanced phase-change nanocapsule composite material as well as a preparation method and application thereof. The heat conduction enhanced phase change nanocapsule composite material is prepared from the following raw materials in percentage by mass: 10.53 percent to 26.09 percent of inorganic shell phase change nanocapsules, 26.09 percent to 31.58 percent of high heat conduction filler, 43.47 percent to 52.63 percent of polydimethylsiloxane prepolymer and 4.35 percent to 5.26 percent of a curing agent. Dispersibility of the phase-change nanocapsule and the high-thermal-conductivity filler in a matrix is enhanced jointly through solvent assisted dispersion and intermittent feeding, so that the material has higher thermal conductivity and thermal storage capacity. The inorganic shell phase change nanocapsule enables the hardness of the polydimethylsiloxane-based composite material to be reduced, so that the composite material is more favorable for being attached to an interface. The material is used as a thermal interface material and is expected to fill air gaps, relieve thermal shock of a chip under high heat flux density and help the chip, an electronic device and the like to dissipate heat better.

Description

technical field [0001] The invention belongs to the technical field of composite material heat storage, and in particular relates to a phase-change nanocapsule composite material with enhanced thermal conductivity and a preparation method and application thereof. Background technique [0002] With the rapid development of information technology such as "5G" communication, electronic chips are constantly developing towards small size, high integration, and high power, resulting in a rapid increase in the heat flux density per unit volume of the chip, which brings an instantaneous thermal shock to the chip. This will lead to a sharp increase in temperature, which can easily cause problems such as aging, stress deformation, shortened life and malfunction of electronic components. Therefore, there is an urgent need to develop high-performance thermal interface materials. Phase change materials refer to substances that have the ability to absorb and release heat. Introducing pha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/06C09K5/14
CPCC09K5/063C09K5/14
Inventor 方晓明李淑珊张正国凌子夜
Owner SOUTH CHINA UNIV OF TECH
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