Manufacturing method for uncovering multiple layers in same area of multilayer circuit board

Abstract

The invention discloses a manufacturing method for uncovering multiple layers in the same area of a multilayer circuit board, which comprises the following steps of: pressing a first single-sided copper-clad substrate on one side of a double-sided copper-clad substrate to form a first multilayer board; pre-etching the first multilayer board according to a preset uncovering area; punching the second single-sided copper-clad substrate according to a preset uncovering area to form a receding groove penetrating through the second single-sided copper-clad substrate; according to a preset uncovering area, laminating and etching the punched second single-sided copper-clad substrate and the pre-etched first multi-layer board in sequence to obtain a second multi-layer board; and judging whether the second multilayer board meets a preset uncovering layer number or not, and sequentially performing laser and adhesive tearing on the second multilayer board according to a preset uncovering area and a judgment result to obtain a target multilayer board of which multiple layers are uncovered in the same area. According to the invention, the problems of poor lamination caused by a single high-fall step and missing tearing caused by the height difference of the board surface are avoided, and the yield of uncovering multiple layers in the same area of the multilayer board is improved.

Description

technical field [0001] The invention relates to the technical field of manufacture of flexible circuit boards, in particular to a manufacture method of opening a cover and multiple layers in the same area of ​​a multilayer circuit board. Background technique [0002] Flexible Printed Circuit (FPC or Flex for short) is a highly reliable and excellent flexible printed circuit board made of polyimide (PI) or polyester film as the base material. . Flexible circuit boards are divided into single-sided, double-sided and multi-layer boards (three or more layers) according to thickness and number of layers. Because the higher the number of layers and the thicker the thickness of the flexible circuit board, the worse the bending performance and the reliability cannot meet the requirements. Therefore, in the design of conventional flexible circuit boards, single-sided and double-sided manufacturing processes are used for circuit boards that need to be bent. [0003] However, as ele...

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Problems solved by technology

[0011] In view of this, the present invention provides a multi-layer manufacturing method of opening the cover in the same area of ​​the multi-layer circuit board, so as to solve the problem of poor lamination and step-by-step front opening caused by a single step with a high drop when the cover is opened simultaneously in the prior art. When the cover is opened, it is caused by the height difference of the board surface, and the laser parameters are difficult to control when the cover is opened at the same time, resulting in different laser depths.

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