Method of connecting conductive wire to semiconductor chip

Abstract

This invention relates to a method for connecting a conductive line to a semiconductor chip including a conductive pad aligning with through hole of the conductive line and a base layer covering the through hole opposite the chip in which the conductive line and based layer are in different materials, removing part or whole base layer to expose the through hole, forming a contact point connectingelectrically with the conductive line and the pad. The said method includes coating the conductive line on the base layer, sticking the chip to conductive line mechanically before removing part or whole of base layer at the back of the aligning pad and through hole and forming an adhesive with the open-end just below the through hole, so as to expose the pad after removing part or whole of the base layer and before forming the contact.

Description

technical field [0001] The present invention relates to a semiconductor chip assembly, in particular to a method for mechanically and electrically connecting conductive traces to a semiconductor chip. Background technique [0002] Semiconductor chips have input / output pads that must be connected to external circuits to function as part of an electronic system. A typical connection medium is an array of metal leads (such as a lead frame) or supporting circuitry (such as a substrate), but direct connection to a circuit board (such as a motherboard) is also possible. Several connection technologies are widely used. Includes wire bonding, tape automated bonding (TAB), and flip chip bonding. [0003] Wire bonding is by far the most common and economical connection technology. In this method, the wires are bonded from the chip to the external loop one by one by thermocompression, thermal acoustic vibration treatment or ultrasonic treatment. In thermocompression bonding, thin g...

AI Technical Summary

Problems solved by technology

As previously mentioned, organic conductive adhesive bumps with conductive fillers in polymeric binders have been used, but generally fail to form a metallurgical interface in the traditional sense

Moisture passing through the polymer binder may cause corrosion or oxidation of the conductive filler particles, resulting in an unstable electrical connection

In addition, polymer binders and conductive fillers may degrade, resulting in unstable electrical connections

Such conductive adhesives have adequate mechanical strength but poor electrical properties

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