Method and appts. for ionized sputtering of materials
A technology of ionization and equipment, which is applied in the field of sputtering, can solve the problems of increasing the design of the vacuum chamber, reducing the quality, reducing the uniformity of the operating pressure, and achieving the effect of avoiding reaction and preventing the loss of orientation
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[0019] The first embodiment
[0020] In the first embodiment, the RF element includes a spiral winding around the chamber from behind a quartz window, which is mostly cylindrical, which is used as a protective structure. The quartz windshield, which is mostly cylindrical, may constitute a part of the inner wall of the sealed real hole of the chamber, or it may be in the form of an insulator surrounding the coil inside the chamber, or some other form of insulating the coil conductor from the process gas.
[0021] A substantially cylindrical shield is provided to surround the chamber in close proximity to the window separating the coil from the PVD processing chamber. The shield is preferably cut in a direction parallel to the axis of its chamber. The so-called "close proximity" means that the distance from the window is short enough to prevent the formation of plasma between the shield and the window. This cut shield imitates the shape of a dielectric window that separates the coil...
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[0025] Second embodiment
[0026] In the second embodiment, the housing, the dielectric window, and the integral or segmented insulation are used alone or in combination to protect the RF component from the plasma and the sputtered material together. The shielding array is preferably in the form of multiple shielding subsections, which can be biased to control the sputtering of the plasma. The shielding array has a plurality of gaps to electrically cut off the shielding subsections at least partially to prevent the induced eddy current from consuming energy and resisting the coupling of energy to the plasma. Furthermore, the individual shielding sections are preferably electrically separated so that they can be individually biased to optimize the uniformity of coating on the substrate and the orientation of the ionized material on the substrate. The intervals between the shielding sections are used to transfer plasma from behind the shielding into the processing space.
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[0027] The third embodiment
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