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Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates

A benzotriazole and adhesive technology, applied in the field of adhesive compositions, can solve problems such as insufficient to provide good adhesion of copper lead frames

Active Publication Date: 2007-01-10
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these compositions are still insufficient to provide good adhesion to copper lead frames

Method used

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  • Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates
  • Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates
  • Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates

Examples

Experimental program
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Effect test

Embodiment

[0013] Two free radical curable resin and initiator formulations (RCR) were prepared as controls. These control compositions were extended with varying levels of combinations of epoxy and carboxybenzotriazole with reactive double bonds. All formulations were tested for die shear strength according to the following protocol:

[0014] Each formulation was dispensed on a copper metal lead frame supplied by Hirai Seimitu Kougyou Co. (Japan). This was then used to place a 300 x 300 x 15 mil bare silicon die over the adhesive. All samples were cured in an oven ramped to 175°C over 30 minutes and held at 175°C for 15 minutes under nitrogen. These samples were then placed on a 240°C hot plate for 1 minute followed by an oven at 175°C for 4 hours to simulate the semiconductor packaging process. The resulting samples were tested for die shear strength with a Model Dagy 2400PC from Dagy Corporation.

[0015] These formulations and results are listed in the table below.

[0016] ...

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PUM

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Abstract

An adhesive for use on metal substrates, and particularly on copper substrates, comprises (a) carboxyl benzotriazole, (b) an epoxy resin having a reactive double bond, (c) a radical curing resin, and (d) a radical initiator. The combination of elements (a) and (b) in a radical curing resin system composed of the elements (c) and (d) provides improved adhesion strength to copper metal compared to compositions containing (c) and (d) without (a) and (b).

Description

technical field [0001] The present invention relates to adhesive compositions for use on metal substrates, particularly copper lead frames in semiconductor packages. Background technique [0002] Carboxybenzotriazole is known as a good chelating material for copper metal. It is used not only as an antioxidant for metal substrates but also as an adhesion promoter for epoxy pastes. For example, free radical curable resins such as acrylate or methacrylate, maleimide resins, vinyl ether resins, and bimaleimide resins have been used due to their low moisture absorption, curing ability, and long shelf life. Research has been conducted and applied to the use of die attach adhesives in semiconductor packaging. However, these compositions are still insufficient to provide good adhesion to copper lead frames. Contents of the invention [0003] The present invention is an adhesive used on a metal substrate, especially a copper substrate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/10C09J129/10C09J4/06C09J5/06C09J11/06C09D163/10C08K5/00C08K5/3475C08L15/00C08L75/16C09J4/00
CPCC09J4/00C08K5/3475C09J163/10C08L75/16C08L15/00C08L2666/20C08L63/10C08F220/32C08K5/00
Inventor T·塔卡诺
Owner HENKEL KGAA