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Dendritic or polygonal bimetal Cu-Mg superfine powder and its prepn

A technology of metal powder and metal powder, which is applied in the field of metal powder and its preparation, can solve the problems of easy oxidation of copper powder and high preparation cost of silver powder, and achieve the effect of low cost, simple preparation method and not easy oxidation

Inactive Publication Date: 2002-08-07
SHANGHAI WEILAI NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] One of the technical problems to be solved in the present invention is to disclose a low-cost, non-oxidizable dendritic or polygonal ultrafine copper-silver bimetallic powder broad-spectrum antibacterial agent and conductive metal powder to overcome the existing technology. Existing copper powder is easy to oxidize, and the preparation cost of silver powder is high;

Method used

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  • Dendritic or polygonal bimetal Cu-Mg superfine powder and its prepn
  • Dendritic or polygonal bimetal Cu-Mg superfine powder and its prepn
  • Dendritic or polygonal bimetal Cu-Mg superfine powder and its prepn

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Preparation of copper powder:

[0031] 6.25g of CuSO 4 ·5H 2 O and 1.02g of PVP were dissolved in 100ml of deionized water, kept at a constant temperature of 70°C for 30 minutes, and then prepared 100ml of hydrazine hydrate solution (hydrazine hydrate concentration was 0.75mol / L), kept at a constant temperature of 70°C, and then mixed the copper sulfate solution with stirring Drop into hydrazine hydrate solution, react for 40 minutes, wash and filter to obtain copper powder.

[0032] Add 100ml of water to the above copper powder and stir to disperse evenly, then add 4.25g of AgNO 3 And 1.0g of PVP was dissolved in 100ml of deionized water, then added dropwise to the copper powder suspension, reacted for 30 minutes, filtered, and the filter cake was collected to obtain Cu-Ag bimetallic powder with a silver-to-copper ratio of 2:1.

[0033] JEM-1200EXII transmission electron microscope was used to observe its morphology as dendritic, and the bactericidal efficiency test...

Embodiment 2

[0037] Preparation of copper powder:

[0038] 6.25g of CuSO 4 ·5H 2 O and 1.02g of PVP were dissolved in 100ml of deionized water, kept at a constant temperature of 70°C for 30 minutes, and then prepared 100ml of hydrazine hydrate solution (hydrazine hydrate concentration was 0.75mol / L), kept at a constant temperature of 70°C, and then mixed the copper sulfate solution with stirring Drop into hydrazine hydrate solution, react for 40 minutes, wash and filter to obtain copper powder.

[0039] Add 100ml of water to the above copper powder and stir to disperse evenly, then add 4.25g of AgNO 3 And 0.35g of gelatin was dissolved in 100ml of deionized water, then added dropwise to the copper powder suspension, reacted for 30 minutes, filtered, and the filter cake was collected to obtain Cu-Ag bimetallic powder with a silver-to-copper ratio of 2:1.

[0040] JEM-1200EXII transmission electron microscope was used to observe its shape as hexagon, and LS230 laser particle size analyzer...

Embodiment 3

[0044] Preparation of copper powder:

[0045] 9.375g of CuSO 4 5H 2O and 1.02g of PVP were dissolved in 100ml of deionized water, kept at a constant temperature of 70°C for 30 minutes, and then prepared 100ml of hydrazine hydrate solution (hydrazine hydrate concentration was 1.13mol / L), kept at a constant temperature of 70°C, and then mixed the copper sulfate solution with stirring Drop into hydrazine hydrate solution, react for 40 minutes, wash and filter to obtain copper powder.

[0046] Add 100ml of water to the above copper powder and stir to disperse evenly, then add 4.25g of AgNO 3 And 1.0g of PVP was dissolved in 100ml of deionized water, then added dropwise to the copper powder suspension, and reacted for 30 minutes to obtain Cu-Ag bimetallic powder with a silver-to-copper ratio of 1:1.

[0047] The dendritic shape was observed with a JEM-1200EXII transmission electron microscope, and the bactericidal efficiency test was carried out according to the GB15979-1995 met...

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Abstract

Firstly, preparing a superfinc copper powder, placing the copper powder in water, uniformly stirring it and uniformly dispersing, placing it on hot-water bath to keep constant temperature, then adding silver ions in suspension of copper powder in the presence of macromolecular protecting agent, making silver ions and copper produce displacement reaction, so that the surface portion of the copper particle or whole can be covered with silver ion. It has two form: (1). denditic form, its grain size is 1 micrometer-20 micrometers; and (2). polygonal form, its grain size is 100 nm-2 micronmeters. It can be used as antibacterial agent, can simultaneously kill bacteria and fungi.

Description

technical field [0001] The invention belongs to the technical field of metal powder and its preparation, and relates to a metal powder with antibacterial and conductive properties, in particular to a copper-silver bimetallic powder. Background technique [0002] Metal ultrafine particles are metal clusters composed of metal atoms, which are different from the metal as a whole and also from metal atoms. They are metastable states between metal solids and metal atoms. Because metal ultrafine particles have the characteristics of small particle size and large surface area, they have many special properties, especially as a catalyst with high activity and high selectivity, which has been reported in detail in many documents; [0003] In the literature "Annals of Bacteria Prevention" 22 No.9531-536 (1994), Masahiko Takayama reported that copper ions have a very significant effect on killing fungi, while silver ions have the best sterilization effect on bacteria; [0004] Literat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/16C22C9/00
Inventor 赵斌吴秀华邵佳敏陶志清
Owner SHANGHAI WEILAI NEW MATERIALS CO LTD