External power supply ring with multiple slender tapes for decreasing voltage drop of integrated circuit

An integrated circuit, narrow and long technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problem of more serious voltage drop, increased power consumption and heat generation, and IC cannot operate normally, so as to reduce noise, The effect of reducing the pressure drop
CN1373511AInactive Publication Date: 2002-10-09VIA TECH INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
VIA TECH INC
Publication Date
2002-10-09
Estimated Expiration
Not applicable · inactive patent

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Abstract

A power supply bus in the form of grid for IC is composed of strips used on data I / O pads and multi-level voltage I / O pads. Said IC has power supply I / O pads connected to power supply bus and data I / O pad connected to circuit. The deposited strips connected with power supply bus are adjacent to data I / O pads. Its advantage is very less voltage drop.
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Description

technical field

[0001] The present invention relates to the field of very large scale integrated circuits, and more particularly to a way of providing the power bus of an integrated circuit while reducing the voltage drop in the core of the integrated circuit. Background technique

[0002] In the Integrated Circuit (IC) industry, Complementary Metal Oxide Semiconductor (CMOS) technology has played an increasingly important role. Over the years, improved CMOS technology has apparently remained the main center stage technology for Very Large Scale Integration (VLSI). CMOS VLSI technology can produce a large number of transistors and input / output (Input / Output, I / O for short) interfaces on an IC (sometimes called a chip) with extremely high operating speed. The improved CMOS VLSI technology with reduced and reduced device size is particularly suitable for production and manufacturing techniques.

[0003] There are many ways to improve the manufacturing process of CMOS, mainly...

Claims

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