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External power supply ring with multiple slender tapes for decreasing voltage drop of integrated circuit

An integrated circuit, narrow and long technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problem of more serious voltage drop, increased power consumption and heat generation, and IC cannot operate normally, so as to reduce noise, The effect of reducing the pressure drop

Inactive Publication Date: 2002-10-09
VIA TECH INC
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

In a typical IC situation, the number of I / O interfaces is fixed, however, power consumption and heat generation will increase due to the increased functionality and its corresponding increased transistors
In addition, the problem of undesired voltage drops becomes worse when using low supply voltages
For example, when an IC is operating at 1.8 volts, even a small voltage drop can prevent the IC from functioning properly
In addition, even noise in the power supply can prevent ICs operating at such low voltages from functioning properly

Method used

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  • External power supply ring with multiple slender tapes for decreasing voltage drop of integrated circuit
  • External power supply ring with multiple slender tapes for decreasing voltage drop of integrated circuit
  • External power supply ring with multiple slender tapes for decreasing voltage drop of integrated circuit

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specific Embodiment approach A

[0047] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A. Development of VLSI Technology

[0048]New processors (sometimes referred to as central processing units (CPUs)) continue to be developed with higher clock frequencies and increased functionality. For example, the reduced instruction set computing (Reduced Instruction Set Computing, RISC for short) architecture will increase the complexity of the interconnection and packaging system due to the input / output (I / O) timing problem caused by the high operating clock frequency. Nowadays, Dynamic Random Access Memory (DRAM) devices, Static Random Access Memory (SRAM) devices, and Electrically Programmable Read-Only Memory (EPROM) The development trend of devices with increased storage capacity and reduced data access time keeps pace with the rapid development of microprocessors. We can say that these microprocessor and memory requirements are the driving force behind IC device technology. The rate at which these new IC devi...

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Abstract

A power supply bus in the form of grid for IC is composed of strips used on data I / O pads and multi-level voltage I / O pads. Said IC has power supply I / O pads connected to power supply bus and data I / O pad connected to circuit. The deposited strips connected with power supply bus are adjacent to data I / O pads. Its advantage is very less voltage drop.

Description

technical field [0001] The present invention relates to the field of very large scale integrated circuits, and more particularly to a way of providing the power bus of an integrated circuit while reducing the voltage drop in the core of the integrated circuit. Background technique [0002] In the Integrated Circuit (IC) industry, Complementary Metal Oxide Semiconductor (CMOS) technology has played an increasingly important role. Over the years, improved CMOS technology has apparently remained the main center stage technology for Very Large Scale Integration (VLSI). CMOS VLSI technology can produce a large number of transistors and input / output (Input / Output, I / O for short) interfaces on an IC (sometimes called a chip) with extremely high operating speed. The improved CMOS VLSI technology with reduced and reduced device size is particularly suitable for production and manufacturing techniques. [0003] There are many ways to improve the manufacturing process of CMOS, mainly...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/50H01L23/52
CPCH01L2924/0002
Inventor 李耿民曹云翔
Owner VIA TECH INC
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