Negative pressure plasma device and cleaning method

Abstract

There are provided a low pressure plasma processing apparatus and method by which a throughput can be improved, film contamination can be effectively prevented, and a film can be readily managed. A film substrate (2) is carried in from the outside of a plasma processing apparatus main body (2) to a substrate carrying position (B) in the plasma processing apparatus main body, the film substrate positioned at the substrate carrying position is carried into a chamber (8), a reaction gas is introduced while the chamber is being evacuated, high frequency power is applied under low pressure to generate plasma so that plasma processing is performed to remove organic matter from the film substrate, and the film substrate subjected to plasma processing is taken out from the chamber and positioned at a substrate carrying-out position (C) in the plasma processing apparatus main body and carried out of the plasma processing apparatus main body.

Description

technical field [0001] The invention relates to a plasma processing device which generates plasma in a negative pressure environment for processing the surface of a substrate to be processed. Background technique [0002] Along with miniaturization and high performance of electronic equipment, high-density assembly is required in the field of assembly technology. For this reason, the connection of components on the assembly substrate must be miniaturized, and the assembly reliability must be higher. As one method of ensuring reliability, there is a plasma surface modification method. For example, plasma treatment removes organic contamination attached to the surface, improves the bonding strength of wire bonding, improves wettability, and improves the adhesion between substrates and sealing resins. That is, the substrate surface is activated by oxygen plasma, and carboxyl groups (COO), carbonyl groups (C=O) and the like are generated, thereby producing a surface activation...

AI Technical Summary

Problems solved by technology

[0005] However, according to the above structure, it is bound to form batch processing, so the production capacity is limited

In addition, since the film is picked and placed by hand, it may cause film contamination

Furthermore, film management is difficult because there is an interval between the cleaning process and the next process

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