Method for processing microtantalum and/or niobium powder and powder made by said method

A processing method and fine technology, which is applied in the processing of fine tantalum and/or niobium powders and the powders produced therefrom, can solve the problems of inability to be exposed for a long time, no practical value, etc., and achieve good stability
CN1449879AInactive Publication Date: 2003-10-22NINGXIA ORIENT TANTALUM IND
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NINGXIA ORIENT TANTALUM IND
Publication Date
2003-10-22
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention relates to a new treatment method for preparing microfine tantalum and / or niobium powder, specially, it relates to a method capable of making halide of tantalum and / or niobium mix with reduced metal in the liquid ammonia and produce reaction to produce microfine tantalum and / or niobium powder and making them undergo the processes of heat treatment and subsequent treatment at high-temp. in the non-oxidation atmosphere. The tantalum and / or niobium powder prepared according to the invented method is a kind of relatively-stable microfine nano-grade powder.
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Description

technical field

[0001] The present invention relates to a new processing method for preparing fine tantalum and / or niobium powders, in particular to a kind of fine tantalum and / or niobium powders produced by mixing and reacting tantalum and / or niobium halides and reducing metals in liquid ammonia. Treatment methods before contact with oxygen-containing media. Background technique

[0002] Tantalum and niobium have similar properties, both of which are high-melting point metals. They have good chemical stability to inorganic acids except hydrofluoric acid, but have high activity to elements such as O, N, and C. Tantalum, niobium or nitrogen-containing tantalum and niobium are used to manufacture electrolytic capacitors, high temperature and corrosion resistant materials, superalloys, hard alloys, spraying protective layers and copper diffusion barrier layers for integrated circuits, etc. Especially when it is used as an electrolytic capacitor, it is required to have a fine p...

Claims

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