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Method for mfg. ceramic part

A technology of ceramic parts and manufacturing method, applied in the field of ceramic parts and their manufacturing, can solve the problems of difficult repair of defects, excessive stress and strain, deviation of sintering shrinkage characteristics, etc.

Inactive Publication Date: 2003-12-24
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because there is a large deviation in sintering shrinkage characteristics between the substrate laminate and the conductor paste, excessive stress and strain are generated between the fired substrate and the electrode, thereby causing defects such as cracks and the like
[0013] If it is a common firing method, if the cracks caused by shrinkage in three directions are small during the firing process, they can be repaired during the firing process, but in the method described in the above-mentioned publication, because There is no shrinkage in the plane direction during the firing process, so once defects such as cracks occur, it is difficult to repair
Once such defects such as cracks occur on the substrate, the reliability of the substrate will be reduced

Method used

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  • Method for mfg. ceramic part
  • Method for mfg. ceramic part
  • Method for mfg. ceramic part

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] In Example 1, the effect of adding molybdenum oxide to the conductor paste was discussed. Table 1 shows the amount of molybdenum trioxide (average particle size: 2.5 μm) added to the silver powder (average particle size: 4.0 μm) in Table 1, and the results of analysis and evaluation of the ceramic multilayer substrates respectively prepared therefrom.

[0031] Sample No.

MoO 3 Amount added (wt%)

defect type

Substrate resistance value (mΩ)

1*

0

C

1.9

2*

0.05

C

1.9

3

0.1

A

2

4

1.0

A

2.7

5

2.5

A

3.1

6

5.0

A

3.8

7*

6.0

A

6.2

[0032] In the table, * mark represents the comparative example with respect to this invention.

[0033] [Type A] - No defects.

[Type B]—a case where the maximum length ...

Embodiment 2

[0038] In Example 2, the influence of the particle size of the silver powder constituting the conductor paste was examined. As shown in Table 2, using silver powder having an average particle diameter of 2.2 to 10.2 μm, conductive pastes were prepared and evaluated by adding 1.0% by weight of molybdenum trioxide to 100% by weight of the conductive powder.

[0039] Sample No.

MoO 3 amount added

(wt%)

Particle size of silver powder

(μm)

defect type

Substrate resistance value

(mΩ)

8

1.0

3.1

A

2.8

4

1.0

4.0

A

2.7

9

1.0

5.1

A

2.7

10

1.0

7.9

A

2.7

11

1.0

10.2

B

2.6

12

1.0

2.2

B

2.9

[0040] In samples No. 4 and 8 to 10 with a silver powder particle size of 3 μm...

Embodiment 3

[0043] In Example 3, the influence of the rate of temperature increase in the firing treatment step was examined. The paste used was sample No. 4 whose silver powder particle size was 4.0 μm and the amount of molybdenum trioxide added was 1.0% by weight.

[0044] Sample No.

MoO 3 amount added

(wt%)

heating rate

(℃ / h)

defect type

Substrate resistance value

(mΩ)

13

1.0

100

B

2.9

14

1.0

200

A

2.7

4

1.0

400

A

2.7

15

1.0

900

A

2.7

16

1.0

1800

A

2.7

17

1.0

5400

A

2.7

18

1.0

9000

B

2.7

[0045] As shown in Table 3, in samples 4 and 14 to 17 with an average temperature rise rate in the range of 200°C / hour to 5500°C / hour, no defects we...

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Abstract

A high-reliability, high-dimension-accuracy ceramic component having electric characteristics thereof not significantly deteriorated and defects such as cracks restricted in the vicinity of an internal electrode in a substrate after firing when subjected to a high-dimension-accuracy firing method in which a glass ceramic laminate is fired while being held between heat shrinkage restricting sheets. A method of producing a ceramic component comprising the conductor printing step of printing on a glass ceramic green sheet a conductor paste having a sintering speed equivalent to that of the glass ceramic green sheet, the laminating step of laminating a plurality of the glass ceramic green sheets to form a laminate, a composite laminating step of further laminating on the one or both surfaces of the laminate heat shrinkage restricting green sheets mainly containing inorganic matters, a binder removing step of removing by burning organic matters from the composite laminate, the firing step of sintering the organic matter-removed composite laminate with sintering behaviors of the glass ceramic green sheets and the conductor paste matched, and the step of removing inorganic matters in the heat shrinkage green sheets.

Description

technical field [0001] The present invention relates to a ceramic component typified by a ceramic multilayer substrate on which semiconductor ICs and chip components are mounted and interconnected and a method for manufacturing the same. Background technique [0002] In recent years, the miniaturization and weight reduction of semiconductor ICs, chip components, etc. have progressed, and the wiring boards on which they are mounted have also tended to be smaller and lighter. Ceramic multilayer substrates are attracting much attention in today's electronic equipment industry because they can realize the required high-density wiring and thin film. [0003] A general method for a ceramic multilayer substrate consists of the following steps. [0004] (1) Preparation and mixing process of ceramic materials. [0005] (2) Forming process of ceramic substrate. [0006] (3) Manufacturing process of conductor paste. [0007] (4) The firing process of the composite laminate composed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03C04B35/638C04B35/64H01L21/48H01L23/15H05K1/09H05K3/46
CPCH05K3/4629C04B2235/3206C04B2235/365B32B2311/08C04B2237/562C04B2235/3217H05K3/4611B32B18/00C04B35/6264C04B35/638C04B35/632C04B2235/96C04B2237/408H05K1/0306C04B2235/3224H01L21/4867C04B2235/3256C04B35/64
Inventor 胜村英则齐藤隆一若林都加佐加贺田博司
Owner PANASONIC CORP