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Thermosetting resin composition and prepreg laminate for circuit board and printed circuit board each made therewith

A technology of resin composition and printed circuit board, which is applied in the direction of printed circuit, printed circuit parts, circuit substrate materials, etc., and can solve the problems of low water absorption, loss of glass transition temperature, failure to meet flame retardant standards, etc.

Inactive Publication Date: 2004-03-24
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when a relatively large amount of epoxy resin is prepared according to this method, the original advantages such as low dielectric dissipation factor, high elastic modulus, high heat resistance, low water absorption, high glass transition temperature and other excellent processability will be lost, and In thinner materials, there may be problems such as failure to meet the flame retardancy standard of V-0 in the flame retardancy standard UL 94, etc.

Method used

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  • Thermosetting resin composition and prepreg laminate for circuit board and printed circuit board each made therewith
  • Thermosetting resin composition and prepreg laminate for circuit board and printed circuit board each made therewith

Examples

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Effect test

Embodiment

[0051] The present invention will be described in detail as follows according to the embodiments. However, the present invention is not limited to the scope of the examples. Hereinafter, unless otherwise specified, the parts represent "parts by weight", and the % represents "% by weight".

Synthetic example 1

[0053] (A-1) Synthesis of thermosetting resin mainly composed of dihydrobenzoxazine ring

[0054] Equipped with a thermometer, a stirrer, and a condenser, add 1,000 g of bisphenol F and 920 g of methanol to a 5-L flask in a dropping device, and dissolve at 50° C. while stirring. Among them, 652 g of paraformaldehyde was added. Then, under stirring, 930 g of aniline was added dropwise in 1 hour. After 1 hour, it was brought to 78 to 80° C., reacted under reflux for 7 hours, and then decompressed and concentrated at 360 mm Hg. Concentration was continued under the reduced pressure, and when the resin temperature reached 110° C., the degree of reduced pressure was increased to 90 mm Hg. After confirming that no more liquid flowed out, the resin was taken out and placed in a tray to obtain a thermosetting resin (A1) mainly composed of a dihydrobenzoxazine ring whose softening point was 78°C.

Synthetic example 2

[0056] (A-2) Synthesis of thermosetting resin mainly composed of dihydrobenzoxazine ring

[0057] The above-mentioned thermosetting resin (A1) mainly composed of dihydrobenzoxazine rings was heated at 110°C for 6 hours under normal pressure to prepare a resin containing dihydrobenzoxazine rings with a softening point of 110°C. Thermosetting resin (A2) as the main component.

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Abstract

The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a dihydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

Description

technical field [0001] The present invention relates to a thermosetting resin composition and uses thereof, such as prepregs, laminates and printed circuit boards for printed circuit boards, molding materials, and adhesive compositions. In particular, it relates to a thermosetting resin composition suitable for impregnation of glass substrates for laminated base substrates, utilizing circuit boards for high frequencies in the MHz band or higher utilizing low dielectric loss factors, and utilizing high modulus of elasticity. Background technique [0002] Recently, electronic devices are required to be thinner, lighter and smaller. Therefore, the printed circuit boards used in these instruments mainly have 4 to 10 layers, and in order to cooperate with high-density assembly, it is required to achieve fine patterning, as well as thinning and layered structure. [0003] In order to suppress the transmission loss when used in high-frequency circuits, and make the circuit operate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/00B32B27/04C08G59/22C08L61/34C08L63/00H05K1/03
CPCB32B27/00C08G59/226H05K1/0326B32B27/04C08L63/00C08L61/34C08L2205/03C08L2205/02Y10T428/24917Y10T428/24636Y10T428/31529Y10T428/31511Y10T428/31515Y10T428/31522Y10T428/24994C08L2666/02C08L2666/16C08L2666/14C08L2666/22C08K3/013C08J5/24H05K1/0373C08L79/04C08L61/06C08L9/00H05K1/036C08J2379/04C08J2461/06C08J2463/00C08J2409/00
Inventor 大堀健一中村吉宏村井曜武田良幸平井康之鸭志田真一垣谷稔阿部纪大沼田俊一相沢辉树七海宪
Owner RESONAC CORP
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