After-package test parametric analysis method

Abstract

A parametric analysis method after package comprises the steps of, searching the data base to obtain the test parameter value after package for each batch of the products, comparing these parameter values, choosing representative parameter value and items, determining whether the test items relates to the packing station, if the result is relevant, dividing the products into at least a first acceptable product group and a first disqualified product group, searching for machine benches where the first acceptable product group passes during the process, searching for machine benches where the first disqualified product group passes during the process, determining the machine bench in which the passing probability of the first disqualified product set is higher than that of the first accepted product set.

Description

technical field [0001] The invention relates to a method for analyzing process parameters, in particular to an analysis method for testing parameters after packaging. Background technique [0002] In semiconductor manufacturing technology, to complete a semiconductor product usually has to go through many processes, such as photolithography process, etching process, ion implantation process, etc.; program of. Therefore, those skilled in the art are committed to ensuring the normal operation of the machine, maintaining or improving the product qualification rate, detecting and confirming problems, and machine maintenance, so as to make the production speed and quality of semiconductor products meet customer needs. [0003] Generally speaking, to discuss the problems of semiconductor technology, we can start to analyze the following data, including process parameter data, in-line QC data, defect inspection data, sample test data ) data, wafer test data and final test data. ...

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Problems solved by technology

[0008] However, since in the prior art, human experience judgment is used to determine the analysis result (step 103) and the corrected value (step 104), so the accuracy and reliability of the final analyzed result will be open to question; in addition People in the semiconductor manufacturing industry change frequently, which makes it difficult to pass on the experience between the former and later engineers, and each engineer has limited ability and cannot take into account the operating status of all the machines in the factory. Therefore, when the test results of semiconductor products are abnormal, the engineer does not see It is necessary to have enough experience to quickly and correctly judge which link is wrong, so it may take a lot of time to conduct relevant research, and it may even make a wrong judgment. In this way, not only will the efficiency of the process be reduced, but the production will be increased cost, and it is impossible to improve the online production situation in time to increase the pass rate

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