Photosensitive resin composition and method for the formation of a resin pattern using the composition

A technology of photosensitive resin and composition, which is applied in the fields of signage, formation of resin graphics, etc., can solve the problem of high product cost and achieve the effect of strong bond strength

Active Publication Date: 2004-11-03
SHIPLEY CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to form highly reliable metal patterns, the content of expensive metals in the paste must be significantly increased, resulting in high product costs

Method used

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  • Photosensitive resin composition and method for the formation of a resin pattern using the composition
  • Photosensitive resin composition and method for the formation of a resin pattern using the composition
  • Photosensitive resin composition and method for the formation of a resin pattern using the composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-9

[0107] In Examples 1-9, metal-resin composites were prepared according to the ingredients listed in Table 1. In Examples 1, 2 and 3, step 9 was carried out according to the method described above. In Examples 4-6 (comparative examples), step 9 was omitted, and step 10 was performed after step 8. In Examples 7-9, instead of Step 9, the surface of the resin pattern was physically polished using a non-woven fabric (trade name: Scotchbright, 3MCo.). In the etching process, a surface layer with a thickness of 0.5 μm was removed. In Examples 1-9, the dark red oily palladium resinate is used as the catalyst precursor. The palladium resinate contains palladium neooctoate with 8 carbon atoms, and its decomposition temperature is 200.1°C. The palladium content in the catalyst precursor was 23 wt%.

[0108] Example

Embodiment 2

[0109] In Examples 2, 3, 8 and 9, nickel deposition on the resin pattern was observed, showing the effectiveness of the method of the present invention in forming metal-resin composites.

[0110] However, on the other hand, when the plasma etching step, Step 9, was omitted, in the results obtained in Examples 4-6 (Comparative Examples), no nickel deposition was observed on the surface of the resin pattern. Therefore, activation treatment of the resin pattern or catalyst exposure treatment, such as surface etching, is necessary.

[0111] In addition, when the plasma etching treatment was replaced by wet etching treatment using sodium permanganate solution, or physical polishing treatment using gravimetric wave (data not shown in Examples 1-9), nickel was not observed on the surface of the resin pattern. deposition. This result shows that the exposure treatment of the catalyst on the surface of the resin pattern is necessary for the method of the present invention.

[0112] In...

Embodiment 10-18

[0114] In Examples 10-18, nickel deposition was studied using various catalyst precursors, see Table 2. The temperature of step 8 listed in the table is the decomposition temperature of the catalyst precursor.

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Abstract

A photosensitive resin composition and a method for the formation of a resin pattern using the photosensitive resin composition are provided. The photosensitive resin composition contains, as a catalyst precursor, a catalytic metal element with a metal-deposition catalytic activity suitable for electroless metal plating. The method for the formation of a resin pattern uses a photosensitive resin composition, which contains, as a catalyst precursor, a catalytic metal element with a metal-deposition catalytic activity suitable for electroless metal plating. By using the method of this invention, it is possible to form a conductive film selectively on a resin pattern formed through exposure and development of the photosensitive resin composition of this invention.

Description

Background technique [0001] The present invention relates to a photosensitive resin composition, which includes a catalytic metal element as a catalyst precursor, and the metal element has metal deposition catalytic activity suitable for metal electroless plating. In particular, the present invention relates to a resin pattern having metal deposition catalytic activity suitable for electroless metal plating and a method for forming the resin pattern. The present invention further relates to the preparation of a metal-resin composite material and a method for forming the metal-resin composite material by metal electroless plating on the above-described resin pattern having metal deposition catalytic activity suitable for metal electroless plating. [0002] Currently, metal electroless plating processes are used to form conductive coating films on insulators. Electroless metal plating treatment is achieved through the following steps. The conditioning step is by cleaning the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004C23C18/30C23C18/31C23C18/48G03F7/038G03F7/039G03F7/40H05K3/18
CPCG03F7/0392G03F7/0382H05K2201/0236G03F7/0043H05K2203/0514G03F7/40H05K3/185H05B6/6414
Inventor 近藤正树神田隆
Owner SHIPLEY CO INC
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