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Coupling structure for optical waveguide and optical device and optical alignment method by using the same

A technology of optical waveguides and optical devices, applied in the field of optical coupling, can solve problems such as difficulty in adjusting transmission characteristics according to needs, difficulty in adjusting the sensitivity of operating devices, and increased manufacturing costs

Inactive Publication Date: 2005-02-02
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For this reason, although the conventional method is capable of mounting the substrate on the housing or the OSA by picking up the substrate formed with the V-shaped groove by using the guide pin, the pick-up device, the substrate The structure of sheet, housing and OSA is complex and undesirably large
In addition, according to the conventional method, the output power band of the transceiver is increased due to mechanical operation errors, and therefore, it is difficult to adjust the transmission characteristics as required
Furthermore, since the level of light received in the light detection device is not constant, it is difficult to adjust the sensitivity of the operating device
Finally, in order to reduce mechanical operation errors in the main components, the manufacturing cost will increase, and as a result, the price competitiveness of the product will be damaged

Method used

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  • Coupling structure for optical waveguide and optical device and optical alignment method by using the same
  • Coupling structure for optical waveguide and optical device and optical alignment method by using the same
  • Coupling structure for optical waveguide and optical device and optical alignment method by using the same

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Embodiment Construction

[0023] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. For the purpose of simplicity and clarity, the known functions and structures adopted below are omitted here because they may make the subject matter of the present invention obvious.

[0024] image 3 is a view showing a coupling structure for an optical waveguide and an optical device according to an embodiment of the present invention. As shown in the figure, a glass substrate 200 provided with a VCSEL (vertical cavity surface emitting laser), a PD (photodiode), and a transimpedance amplifier (transimpedance amplifier) ​​is bonded to a PLC substrate having an optical waveguide formed thereon. 110 on the main body of the OSA 100 . Reference numerals 300 and 301 denote a flexible printed circuit board and a signal line, respectively.

[0025] The OSA body 100 includes a silicon substrate 101 , a PLC layer 110 , and a dummy glass substr...

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Abstract

A coupling structure for coupling an optical waveguide and an optical device is provided. The coupling structure enables to precisely align the optical waveguide and the optical device so that an optical-alignment error can be reduced within a range of a few mum. The coupling structure includes a first substrate, at least one optical waveguide formed on the first substrate to transmit an optical signal, optical alignment dummy waveguides symmetrically aligned on the first substrate about the optical waveguide, a second substrate bonded to the first substrate, at least one optical device mounted on a bottom surface of the second substrate and optically connected to the optical waveguide, and optical-alignment patterns formed at the bottom surface of the second substrate corresponding to the optical alignment dummy waveguides, wherein an optical alignment for the optical waveguide and the optical device is achieved by aligning the optical alignment dummy waveguides with the optical-alignment patterns.

Description

technical field [0001] The present invention relates to optical coupling between optical transmission media and optical devices. More specifically, the present invention relates to a coupling structure and optical alignment method for precisely centering the optical device to a planar lightwave circuit by bonding the optical device to a substrate using a flip chip bonding process . Background technique [0002] Due to the recent demand for data communication including audio and video signals in the Internet, conventional communication systems based on electrical signals have been replaced by optical communication systems. [0003] The optical communication involves converting electrical signals into light energy and then storing the light energy into electrical signals. To do this, it requires the use of an optical transmitter, an optical transmission medium and an optical receiver. PLC (Planar Lightwave Circuit) devices are mainly used as optical transmission media. LDs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/34G02B6/42H01L31/0232H01S5/022H01S5/183
CPCG02B6/4246G02B6/4238G02B6/12007G02B6/29368G02B6/4224G02B6/42
Inventor 李荣敏安峻贤郭圭燮
Owner SAMSUNG ELECTRONICS CO LTD
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