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Bonding wire

A bonding wire and bonding technology, applied in the field of bonding wires, can solve the problems of hydrogen explosion and high cost, and achieve the effect of high bonding strength

Inactive Publication Date: 2005-02-02
SUMITOMO ELECTRIC WINTEC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To prevent explosions, hydrogen leak detectors, etc. are required, resulting in higher costs

Method used

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Experimental program
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Effect test

Embodiment 1 to 3 and 15 and comparative example 1 to 3

[0070] By using a copper bonding wire containing 0.05% by weight of impurities other than copper, the resulting diameter * 20μm leads, Pd plating thickness 0.1μm. During production, by varying the processing conditions and annealing conditions, leads with the stretches shown in Tables 1 and 2 were produced. In Example 15, intermediate annealing was performed. By using these lead wires, ball-forming properties and bond strength of balls with a diameter of 60 μm were evaluated. The results of the evaluation are listed in Tables 3 and 4.

[0071] ( * : Outer diameter of the lead wire with core and coating. )

Embodiment 4 to 6 and 16 and comparative example 4 to 6

[0073] By using a copper bonding wire containing 0.05% by weight of other impurities in addition to copper, a lead wire with a diameter of 25 μm was produced with a Pd plating thickness of 0.1 μm. During production, by varying the processing conditions and annealing conditions, leads with the stretches shown in Tables 1 and 2 were produced. In Example 16, intermediate annealing was performed. By using these lead wires, ball-forming properties and bond strength of balls with a diameter of 70 μm were evaluated. In addition, loop characteristics are evaluated. The results of the evaluation are listed in Tables 3 and 4.

Embodiment 7 to 8 and comparative example 7 to 9

[0075] By using a copper bonding wire containing impurities other than copper in a total weight ratio of 0.005%, a lead wire with a diameter of 25 μm was produced with a Pd plating thickness of 0.1 μm. During production, by varying the processing conditions and annealing conditions, leads with the stretches shown in Tables 1 and 2 were produced. By using these lead wires, ball-forming properties and bond strength of balls with a diameter of 70 μm were evaluated. The results of the evaluation are listed in Tables 3 and 4.

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PUM

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Abstract

A bonding wire having a core mainly consisting of copper and a coating layer formed on the core, wherein the coating layer is made of an oxidation-resistant metal having a melting point higher than that of copper, and the elongation of this bonding wire per unit sectional area is 0.021% / mu m<2> or more; and a bonding wire having a core mainly consisting of copper and a coating layer formed on the core, wherein the coating layer is made of a metal having oxidation resistance higher than that of copper, and the relationship of 0.007 < / = X < / = 0.05 is satisfied wherein an area ratio X is (the area of the coating layer / the area of the core at the section of wire being cut vertically) are provided. The bonding wires thus provided are inexpensive and excellent in ball formation characteristic and bonding characteristic. Further, a ball bonding method characterized in using the above bonding wire is also provided.

Description

technical field [0001] The present invention relates to a bonding wire suitable for connecting electrodes on integrated circuit chips (IC, LSI, transistors, etc.) to conductive wiring on circuit wiring substrates (lead frames, ceramic substrates, printed circuit boards, etc.) ), also relates to ball bonding methods using bonding wires. Background technique [0002] As a method of connecting an integrated circuit chip to a circuit wiring substrate, a ball bonding method, a wedge bonding method, a solder bonding method, a resistance welding method, or the like can be used. Among these methods, a ball bonding method using fine gold wires is generally used. [0003] Generally, the ball bonding method is performed according to the following procedure. The tip of the lead wire guided by a movable capillary (hereinafter referred to as "bond") is melted by the electric discharge between the lead wire and the electrode torch, thereby forming a ball. When ultrasonic waves are appli...

Claims

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Application Information

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IPC IPC(8): H01L21/60C25D5/50C25D7/06H01L23/49
CPCC25D7/0607H01L2924/0105H01L2224/4321H01L2224/05624H01L24/85H01L2224/85045H01L24/78H01L2924/01028H01L2224/48091H01L2924/01083H01L2924/01013H01L2924/01003H01L2224/45015H01L2924/20751H01L2224/85065H01L2924/0103H01L2924/20753H01L2924/19043H01L2924/01007H01L2924/0104H01L2224/48247H01L2924/01033H01L2924/00015H01L2924/01078H01L2924/01016H01L2924/01051H01L2224/456H01L2924/20106H01L2924/01015H01L2224/48624H01L2924/01046H01L2924/01082H01L2224/43848H01L2224/85075H01L2924/01004H01L2224/43825H01L2924/20752H01L2924/01019H01L2924/01029H01L2224/4312H01L2224/78268H01L2224/45655H01L2224/85439H01L2924/014H01L2924/01024H01L2224/45147C25D5/50H01L2224/48824H01L2924/01204H01L2224/48599H01L24/43H01L2924/01047H01L2224/45669H01L2924/01079H01L2224/45565H01L24/45H01L2224/48227H01L2924/14H01L2924/01005H01L2924/01006H01L2224/45664H01L2924/01058H01L2224/45144H01L2924/3025H01L2224/48799H01L24/48H01L2224/48639H01L2224/48839H01L2224/85205H01L2924/00011H01L2924/01001H01L2924/01008H01L2924/01048H01L2924/01026H01L2924/00014H01L2924/01203H01L2224/45644H01L2924/2011H01L2924/01205H01L2924/00H01L2924/20111
Inventor 改森信吾野中毅深萱正人井冈正则
Owner SUMITOMO ELECTRIC WINTEC INC
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