Method for connecting diamond thick film with hard base firmly

A diamond thick film, matrix technology, applied in welding equipment, metal processing equipment, manufacturing tools, etc., to achieve the effect of firm connection, long heat preservation time, and elimination of internal stress

Inactive Publication Date: 2005-02-23
JILIN UNIV
View PDF0 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved in the present invention is to overcome the deficiencies of the background technology, optimize the process and process conditions o

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0012] Example 1

[0013] Pre-processing process:

[0014] a. The thick diamond film is boiled in a mixed solution of sulfuric acid:nitric acid=3:1 for 20 minutes to remove impurities such as graphite on the surface of the diamond film, and rinse the boiled diamond film with clean water.

[0015] b. Use a grinding wheel or a grinder or sandpaper to treat the connected surface of the cemented carbide or steel to remove the surface oxide film.

[0016] c. Prepare 72Ag-28Cu alloy with suitable size according to actual needs, and the general thickness is 0.2~0.3mm. Prepare a mesh Ti foil with a size basically the same as that of the Ag-Cu alloy, generally with a thickness of 20 to 40 μm.

[0017] d. Use acetone or carbon tetrachloride to degrease the diamond thick film, brazing filler metal, and the surface of the substrate to be connected.

[0018] Loading process:

[0019] Stack the samples of cemented carbide or steel, Ag-Cu alloy, mesh Ti foil, and diamond thick film in or...

Example Embodiment

[0024] Example 2

[0025] Using mesh 72Ag-28Cu alloy and TiH 2 An example of the method of powder as an additive is: make a 72Ag-28Cu alloy sheet with a thickness of 0.3mm into a mesh, the aperture is about 0.5mm, and the interval between holes is 0.5-0.6mm; use ethanol and TiH 2 The powders are mixed together and stirred into a paste, filled into the holes of the Ag-Cu alloy sheet, and placed between the diamond film and the object to be connected. Other processes are the same as in Example 1. TiH 2 The particle size of the powder is finer than 50 μm, and this example uses 30 μm TiH 2 pink.

[0026] Ag-Cu alloy is liquid at high temperature, TiH 2 It is reduced to Ti, a part of Ti and liquid Ag-Cu alloy form Ag-Cu-Ti alloy and spread to the welding surface, Ti diffuses to the surface of diamond thick film and forms TiC and Ag-Cu-Ti alloy on the surface of diamond thick film Metallurgical bonding to firmly bond the diamond thick film to the substrate to be joined. This ...

Example Embodiment

[0028] Example 3

[0029] Both the 72Ag-28Cu alloy and the Ti foil in Example 1 are made into sheet mesh, and the effect of Example 1 can also be achieved.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to view more

Abstract

A technology for firmly joining thick film of diamond with hard substrate includes such steps as pretreating, sequentially stacking the subsrate, Ag.Cu alloy sheet, Ti foil or TiH2 (or Ti) powder, and thick film of diamond and table in vacuum furnace, vacuumizing, heating to 870 degc, holding the temp for 40-60 min, cooling to 500 deg.C at 8-12 deg.C/min and natural cooling.

Description

technical field [0001] The invention belongs to the welding field of superhard materials, in particular to a method for connecting a diamond film and a substrate. Background technique [0002] Due to its own characteristics, diamond is not compatible with other materials, and it is difficult to firmly connect with other materials. CVD diamond film is a new material, which is a flake material composed entirely of diamond synthesized by chemical vapor deposition method with hydrocarbon gas as raw material. It does not contain other impurities and has the same excellent properties as natural diamond. The use of diamond thick film to make various processing tools has broad application prospects. But because the diamond film has the same properties as natural diamond, it is difficult to form a strong connection with other materials. In order to achieve the purpose of forming a firm connection between diamond and other objects, the following problems must be solved: 1. A layer o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B23K1/00B23P5/00
Inventor 吕宪义金曾孙吴汉华顾长志邹广田
Owner JILIN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap