Method for rapidly preparing high heat conduction Si3N4 ceramic with low cost
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GUANGDONG UNIV OF TECH
- Publication Date
- 2014-11-26
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the field of non-oxide-based ceramic materials, and specifically discloses a low-cost, rapid preparation of high thermal conductivity Si 3 N 4 ceramic method. Background technique
[0002] Si 3 N 4 Ceramics have excellent properties such as wear resistance, high temperature resistance, and high thermal conductivity, and are widely used in LED heat dissipation substrates, high-speed cutting tools, and key engine parts. Usually Si 3 N 4 Ceramics with high purity Si 3 N 4 The powder is prepared by hot pressing and sintering as raw material, the cost is high, and samples with complex shapes cannot be prepared.
[0003] In order to reduce costs and prepare complex shapes, Si powder was used as raw material to prepare Si by reactive pressure sintering. 3 N 4 ceramics. On the one hand, the powder preparation and ceramic densification are combined into one step, which significantly reduces the cost; on the other hand, throug...