Carrier band material and carrier band
A technology of carrier tape and slurry, applied in paper coating, fiber raw material treatment, flexible covering, etc., can solve the problems of paper layer damage, reduction of surface strength of carrier tape material, and decrease of adhesion
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Examples
Embodiment 1
[0074] Cut the carrier tape material made as above into a width of 8mm, at a temperature of 160°C and a pressure of 0.5kg / cm 2 Only the 2 mm wide part of the polyethylene terephthalate coated tape was heat-sealed for 1 second under the conditions, and after standing for 15 minutes, it was peeled at 180 degrees using a universal tensile testing machine, and the peeling force (N) was measured.
[0075] (parts removal test)
[0076] Put the carrier tape material prepared as above together with the bottom cover paper on the chip-type electronic component loading device to form a mold cavity for electronic component filling, attach the bottom cover paper, load the electronic components, and attach the top cover tape to make the carrier tape (final product). Then, peeling of the covering tape and taking out of the electronic component were performed using the electronic component take-out device. At this time, observe whether there is any failure. The case where there is no failu...
Embodiment 2
[0084] Except that the components of the mixed solution were 50 parts of PVA and 50 parts of styrene-acrylic resin, a carrier tape material was produced in the same manner as in Example 1, and each test was performed.
Embodiment 3
[0086] A carrier tape was produced in the same manner as in Example 2 except that the melting point of the styrene-acrylic resin was changed to 90° C., and various tests were performed.
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Abstract
Description
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