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Polymeric adhesive for exposed wall thermal-insulation

An external wall insulation and polymer technology, used in adhesives, adhesive types, acid copolymer adhesives, etc.

Inactive Publication Date: 2005-07-20
CHANGCHUN UNIV OF SCI & TECH
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  • Abstract
  • Description
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Problems solved by technology

In this process, adhesives are required to complete each step

Method used

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Embodiment Construction

[0025] Several typical formulas are proposed here. Regarding the formula components, the main components are epoxy resin and acrylic resin introduced above, and the polymer compound is polyurethane elastomer and polyacrylate; various additives are selected except water. The situation is that the plasticizer is phthalate, the toughening agent is polyurethane, the diluent is glycidyl ether, the active agent is polyamide resin, the antifreeze agent is ethylene glycol and ethylene glycol, and the emulsifier is Sorbitan monooleate, polyoxyethylene sorbitan monooleate, polyols and amines, flame retardants are tetrabromophthalic anhydride and porous aluminum hydroxide, thickeners are sodium chloride and fibers The water repellent is sodium rosinate. The content of each component in the formula is weight percent (Wt%).

[0026] Recipe one:

[0027] 1. Acrylic resin 25

[0028] 2. Epoxy resin 15

[0029] 3. Polyurethane elastomer + polyacrylate 15

[0030] 4. Phthalates 2

[0031...

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Abstract

The present invention is outer wall heat insulating polymer adhesive as one kind of polymer product and belongs to the field of fine chemical technology. The adhesive of the present invention has main components including polyacrylate resin, epoxy resin and composition polymer, additives including plasticizer, roughener, diluent, active agent, antifreeze agent, emulsifier, flame retardant, thickener and waterproof agent, and water. The adhesive has the advantages of both available polyacrylate resin adhesive and epoxy resin adhesive. In addition, it has excellent antiseepage, antifreeze, fireproof and other performance, and can meet the requirement in heat insulation in cold area.

Description

technical field [0001] The invention relates to a product containing a high molecular polymer, which belongs to the technical field of fine chemicals. Background technique [0002] Known polymeric adhesives relevant to the present invention are epoxy resins and acrylic resins. A Chinese patent application with application number 85100135 discloses a technical solution called "medium temperature curing high-strength epoxy adhesive". The bonding ingredient is still epoxy resin. A Chinese patent application with application number 87107098 discloses a technical solution named "Three New Types of Emulsion Adhesives of Acrylic Ester Series", which is proposed to provide three kinds of products, in which the bonding ingredients are still Acrylate. Recently, there is an article in the literature about the present invention published in China's "Synthetic Materials Aging and Application" magazine, No. 4, 2001, entitled "Research Progress in Polyacrylate Emulsion Adhesives". The a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/00C09J133/02C09J163/00
Inventor 魏长平孙小飞
Owner CHANGCHUN UNIV OF SCI & TECH
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