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Heat resistant film and its metal laminate

一种薄膜、积层的技术，应用在金属层状产品、热塑性聚合物电介质、介电特性等方向，能够解决操作适应性不足、机械强度达到足够的水平、耐折性、抗弯曲性不足等问题

Inactive Publication Date: 2005-08-03
MITSUBISHI PLASTICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the mechanical strength, especially the end crack resistance value is not necessarily sufficient, and the connection reliability of the substrate is poor due to insufficient folding resistance and bending resistance.
Furthermore, there is also the problem of insufficient operational adaptability in the substrate processing process, and it is desired to improve these problems

Method used

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  • Heat resistant film and its metal laminate
  • Heat resistant film and its metal laminate
  • Heat resistant film and its metal laminate

Examples

Experimental program
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preparation example Construction

[0021] The preparation method of amorphous polyetherimide resin is not particularly limited, generally, has the amorphous polyetherimide resin of above-mentioned structural formula (1), as 4,4'-[isopropylidene-bis( A condensation polymer of p-phenylene (oxy)diphthalic dianhydride and p-phenylenediamine, or an amorphous polyetherimide resin having the above formula (2), as 4,4'-[isopropylene A polycondensate of bis(p-phenyleneoxy)diphthalic dianhydride and m-phenylenediamine is synthesized by a known method. In the above-mentioned amorphous polyetherimide resin, other copolymerizable monomer units may be introduced within a range not departing from the spirit of the present invention.

[0022] The crystalline polyaryl ketone resin is a thermoplastic resin containing an aromatic ring bond, an ether bond, and a ketone bond in its structural unit, and representative examples thereof include polyether ketone, polyether ether ketone, and polyether ketone ketone. In the present inve...

Embodiment 1

[0052] As shown in Table 1, the present invention contains 30 parts by weight of polyetherimide resin [manufactured by GE, Ultem-CRS5001, Tg: 226° C.] (hereinafter referred to as PEI-1) as resin (A-1), 20 parts by weight of polyetherimide resin [manufactured by GE, Ultem-1000, Tg: 216° C.] (hereinafter abbreviated as PEI-2) as resin (A-2), polyetheretherketone as resin (B) A mixture of 50 parts by weight of resin [manufactured by VICTREX, PEEK381G, Tg: 143°C, Tm: 334°C] (hereinafter referred to as PEEK) and 25 parts by weight of commercially available mica (average particle size: 10 μm, aspect ratio: 50) Using an extruder equipped with a T die, extrude a film with a thickness of 75 μm at a set temperature of 380 ° C, and at the same time obtain a single-sided copper foil product by laminating copper foil (thickness: 18 μm, surface roughness) layer film. In addition, a simple thin film having a thickness of 75 μm for evaluation was also obtained. Next, the obtained single-sid...

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Abstract

A heat-resistant film which comprises a mixture obtained by compounding 100 parts by weight of a resin composition comprising at least three ingredient, i.e., (A-1) a polyetherimide resin having repeating units represented by the following structural formula (1), (A-2) a polyetherimide resin having repeating units represented by the following structural formula (2), and (B) a polyaryl ketone resin having a crystal fusion peak temperature of 260 DEGC or higher, with 5 to 50 parts by weight of a filler, characterized in that the proportion of each ingredient satisfies the relationships {(A-1)+(A-2 / (B)=(70-30) / (30-70) and (A-1) / (A-2)=(70-30) / (30-70).

Description

technical field [0001] The present invention relates to a heat-resistant film suitable for components for electronic devices, especially copper foil laminates. Specifically, it relates to a heat-resistant film having good thermal welding properties at low temperatures (≤260° C.) A heat-resistant film and a metal laminate thereof having an excellent balance of brazing heat resistance and end crack resistance after treatment. Background technique [0002] Crystalline polyaryl ketone resins represented by polyetheretherketone resins are widely used mainly in aircraft parts and electrical and electronic parts due to their excellent heat resistance, flame retardancy, hydrolysis resistance, and chemical resistance. However, since polyaryl ketone resins are not only very expensive as raw materials, but also have a relatively low glass transition temperature of about 140-170° C., various studies have been made to improve heat resistance. Among them, a blend with an amorphous polyet...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B7/12B32B15/08C08G73/10C08J5/18C08L71/00C08L71/10C08L79/08H05K1/03
CPCC08J2371/10B32B7/12C08L79/08H05K1/0326C08L2205/03H05K2201/0209C08L71/00H05K1/0346C08J5/18B32B15/08C08J2379/08H05K1/0373H05K2201/0129H05K1/0353H05K2201/0154C08L71/10C08L2205/02Y10T428/31678Y10T428/31681Y10T428/31721C08L2666/14C08L2666/20C08L2666/22B32B15/18B32B15/20B32B27/281B32B27/285B32B2309/12B32B2311/12B32B2311/24
Inventor 谷口浩一郎
Owner MITSUBISHI PLASTICS INC