Flexible laminose plate and method for manufacturing the same

A laminated board and flexible technology, which is applied in the field of flexible laminated board and its manufacturing method, can solve the problems of not considering the application of design to installation purposes and the like

Active Publication Date: 2006-02-15
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the resin composition described in Patent Document 3 can be used as a surface protection film of a semiconductor chip, an interlayer insulating film of a semiconductor package, and an interlayer insulating film of a substrate for mounting a semiconductor pa

Method used

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  • Flexible laminose plate and method for manufacturing the same
  • Flexible laminose plate and method for manufacturing the same
  • Flexible laminose plate and method for manufacturing the same

Examples

Experimental program
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Synthetic example 4、5

[0086] BAPP and TPE-Q were supplied and dissolved in DMAc, and then PMDA was supplied and stirred at room temperature for about 3 hours to prepare a polyimide precursor resin solution composed of the components shown in Table 1. The polyimide precursor resin solution was processed in the same manner as in Synthesis Example 1 to form a polyimide film, and its physical properties were evaluated. The results are shown in Table 1.

Synthetic example 6、7

[0088] BAPP and TPE-R were supplied and dissolved in DMAc, and then PMDA was supplied and stirred at room temperature for about 3 hours to prepare a polyimide precursor resin solution composed of the composition shown in Table 1. The polyimide precursor resin solution was processed in the same manner as in Synthesis Example 1 to form a polyimide film, and its physical properties were evaluated. The results are shown in Table 1.

Synthetic example 8

[0090] BAPP was supplied and dissolved in DMAc, followed by sequential supply of PMDA and DSDA, and stirred at room temperature for about 3 hours to prepare a polyimide precursor resin solution composed of the composition shown in Table 1. The polyimide precursor resin solution was processed in the same manner as in Synthesis Example 1 to form a polyimide film, and its physical properties were evaluated. The results are shown in Table 1.

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Abstract

To provide a flexible laminated board coping with mounting conditions under high temperature and high pressure while retaining characteristics possessed by the flexible laminated board. In the flexible laminated board having a metal foil on one surface or both surfaces of an insulating resin layer, the insulating resin layer comprises a plurality of layers of a polyimide resin provided with at least one high elastic modulus resin layer in contact with the metal foil of a polyimide resin with >=1*10<8>Pa storage elastic modulus at 350[deg.]C, and at least one low thermal expansion resin layer of <=20*10<-6>/K linear expansion coefficient, where the rate of thickness of the high elastic modulus layer in the insulating resin layer is in the range of 3-45%.

Description

technical field [0001] The present invention relates to a flexible laminate and its manufacturing method, in the field of electronic materials, especially the flexible laminate composed of metal foil and polyimide insulating resin layer for forming circuits. Background technique [0002] Polyimide film is superior in thermal properties, insulation, and solvent resistance, and has been widely used as a material for electrical / electronic equipment parts such as mobile phones. In recent years, as mobile phones have become thinner and more functional, substrates mounted on materials for their machine parts have changed from rigid substrates to flexible printed circuit boards. Flexible laminated boards are widely used in such flexible printed circuit boards. In some flexible laminated boards, adhesive resin such as epoxy resin is used for the insulating resin layer adjacent to the metal foil, and adhesive resin such as epoxy resin is used for the base part. The insulating resin ...

Claims

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Application Information

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IPC IPC(8): B32B27/08B32B15/08B32B37/15B32B37/06
CPCB32B15/08B32B27/281B32B37/24B32B2037/243B32B2307/206B32B2307/51B32B2307/538
Inventor 松山浩幸竹内正彦
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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